ZHCSPI9A December   2021  – December 2022 OPT4001

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 说明（续）
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Spectral Matching to Human Eye
      2. 8.3.2 Automatic Full-Scale Range Setting
      3. 8.3.3 Output Register CRC and Counter
        1. 8.3.3.1 Output Sample Counter
        2. 8.3.3.2 Output CRC
      4. 8.3.4 Output Register FIFO
      5. 8.3.5 Threshold Detection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Modes of Operation
      2. 8.4.2 Interrupt Modes of Operation
      3. 8.4.3 Light Range Selection
      4. 8.4.4 Selecting Conversion Time
      5. 8.4.5 Light Measurement in Lux
      6. 8.4.6 Light Resolution
    5. 8.5 Programming
      1. 8.5.1 I2C Bus Overview
        1. 8.5.1.1 Serial Bus Address
        2. 8.5.1.2 Serial Interface
      2. 8.5.2 Writing and Reading
        1. 8.5.2.1 High-Speed I2C Mode
        2. 8.5.2.2 Burst Read Mode
        3. 8.5.2.3 General-Call Reset Command
        4. 8.5.2.4 SMBus Alert Response
    6. 8.6 Register Maps
      1. 8.6.1 ALL Register Map
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Electrical Interface
        1. 9.2.1.1 Design Requirements
          1. 9.2.1.1.1 Optical Interface
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Optomechanical Design (PicoStar Variant)
          2. 9.2.1.2.2 Optomechanical Design (SOT-5X3 Variant)
        3. 9.2.1.3 Application Curves (PicoStar Variant)
    3. 9.3 Do's and Don'ts
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
        1. 9.5.2.1 Soldering and Handling Recommendations (SOT-5X3 Variant)
        2. 9.5.2.2 Soldering and Handling Recommendations (PicoStar Variant)
          1. 9.5.2.2.1 Solder Paste
          2. 9.5.2.2.2 Package Placement
          3. 9.5.2.2.3 Reflow Profile
          4. 9.5.2.2.4 Special Flexible Printed-Circuit Board (FPCB) Recommendations
          5. 9.5.2.2.5 Rework Process
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 术语表
  11. 11Mechanical, Packaging, and Orderable Information
9.5.2.2.1 Solder Paste

For solder-paste deposition, use a stencil-printing process that involves the transfer of solder paste through predefined apertures with the application of pressure. Stencil parameters, such as aperture area ratio and fabrication process, have a significant impact on paste deposition. Cut the stencil apertures using a laser with an electropolish-fabrication method. Taper the stencil aperture walls by 5° to facilitate paste release. Shifting the solder-paste towards the outside of the device minimizes the possibility of solder getting into the device sensing area. See the mechanical packages attached to the end of this data sheet.

Use solder paste selection type 4 or higher, no-clean, lead-free solder paste. If solder splatters in the reflow process, choose a solder paste with normal- or low-flux contents, or alter the reflow profile per the Section 9.5.2.2.3.
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |