ZHCSSP5D January   2009  – September 2023 TPS54332

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics: Characterization Curves
    8. 6.8 Typical Characteristics: Supplemental Application Curves
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed Frequency PWM Control
      2. 7.3.2  Voltage Reference (Vref)
      3. 7.3.3  Bootstrap Voltage (BOOT)
      4. 7.3.4  Enable and Adjustable Input Undervoltage Lockout (VIN UVLO)
      5. 7.3.5  Programmable Slow Start Using the SS Pin
      6. 7.3.6  Error Amplifier
      7. 7.3.7  Slope Compensation
      8. 7.3.8  Current Mode Compensation Design
      9. 7.3.9  Overcurrent Protection and Frequency Shift
      10. 7.3.10 Overvoltage Transient Protection
      11. 7.3.11 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation With VIN < 3.5 V
      2. 7.4.2 Operation With EN Control
      3. 7.4.3 Eco-mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design with WEBENCH® Tools
        2. 8.2.2.2  Switching Frequency
        3. 8.2.2.3  Output Voltage Set Point
        4. 8.2.2.4  Input Capacitors
        5. 8.2.2.5  Output Filter Components
        6. 8.2.2.6  Inductor Selection
        7. 8.2.2.7  Capacitor Selection
        8. 8.2.2.8  Compensation Components
        9. 8.2.2.9  Bootstrap Capacitor
        10. 8.2.2.10 Catch Diode
        11. 8.2.2.11 Output Voltage Limitations
        12. 8.2.2.12 Power Dissipation Estimate
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
      3. 8.4.3 Estimated Circuit Area
      4. 8.4.4 Electromagnetic Interference (EMI) Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 Custom Design with WEBENCH® Tools
    2. 9.2 支持资源
    3. 9.3 接收文档更新通知
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Mechanical, Packaging, and Orderable Information

7.3.11 Thermal Shutdown

The device implements an internal thermal shutdown to protect itself if the junction temperature exceeds 165°C. The thermal shutdown forces the device to stop switching when the junction temperature exceeds the thermal trip threshold. After the die temperature decreases below 165°C, the device reinitiates the power-up sequence.
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