ZHCSTU3C February   2019  – January 2024 UCC21732-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics
    10. 5.10 Switching Characteristics
    11. 5.11 Insulation Characteristics Curves
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Propagation Delay
      1. 6.1.1 Regular Turn-OFF
    2. 6.2 Input Deglitch Filter
    3. 6.3 Active Miller Clamp
      1. 6.3.1 External Active Miller Clamp
    4. 6.4 Under Voltage Lockout (UVLO)
      1. 6.4.1 VCC UVLO
      2. 6.4.2 VDD UVLO
    5. 6.5 OC (Over Current) Protection
      1. 6.5.1 OC Protection with 2-Level Turn-OFF
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Power Supply
      2. 7.3.2  Driver Stage
      3. 7.3.3  VCC and VDD Undervoltage Lockout (UVLO)
      4. 7.3.4  Active Pulldown
      5. 7.3.5  Short Circuit Clamping
      6. 7.3.6  External Active Miller Clamp
      7. 7.3.7  Overcurrent and Short Circuit Protection
      8. 7.3.8  2-Level Turn-Off
      9. 7.3.9  Fault ( FLT, Reset and Enable ( RST/EN)
      10. 7.3.10 Isolated Analog to PWM Signal Function
    4. 7.4 Device Functional Modes
  9. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Filters for IN+, IN- and RST/EN
        2. 8.2.2.2 PWM Interlock of IN+ and IN-
        3. 8.2.2.3 FLT, RDY and RST/EN Pin Circuitry
        4. 8.2.2.4 RST/EN Pin Control
        5. 8.2.2.5 Turn-On and Turn-Off Gate Resistors
        6. 8.2.2.6 External Active Miller Clamp
        7. 8.2.2.7 Overcurrent and Short Circuit Protection
          1. 8.2.2.7.1 Protection Based on Power Modules with Integrated SenseFET
          2. 8.2.2.7.2 Protection Based on Desaturation Circuit
          3. 8.2.2.7.3 Protection Based on Shunt Resistor in Power Loop
        8. 8.2.2.8 Isolated Analog Signal Sensing
          1. 8.2.2.8.1 Isolated Temperature Sensing
          2. 8.2.2.8.2 Isolated DC Bus Voltage Sensing
        9. 8.2.2.9 Higher Output Current Using an External Current Buffer
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 第三方米6体育平台手机版_好二三四免责声明
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 静电放电警告
    7. 11.7 术语表
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

4 Pin Configuration and Functions

GUID-7E4DEED9-C020-4E3A-8D26-B06175AE4835-low.gif Figure 4-1 UCC21732-Q1DW SOIC (16)Top View
Table 4-1 Pin Functions
PIN I/O(1) DESCRIPTION
NAME NO.
AIN 1 I Isolated analog sensing input, parallel a small capacitor to COM for better noise immunity. Tie to COM if unused.
OC 2 I Over current detection pin, support lower threshold for SenseFET, DESAT, and Shunt resistor sensing. Tie to COM if unused.
COM 3 P Common ground reference, connecting to emitter pin for IGBT and source pin for SiC-MOSFET
OUTH 4 O Gate driver output pull up
VDD 5 P Positive supply rail for gate drive voltage, Bypassing a >10-μF capacitor to COM to support specified gate driver source peak current capability. Place decoupling capacitor close to the pin.
OUTL 6 O Gate driver output pull down
CLMPE 7 O External Active miller clamp, connecting this pin to the gate of the external miller clamp MOSFET. Leave floating if unused.
VEE 8 P Negative supply rail for gate drive voltage. Bypassing a >10-μF capacitor to COM to support specified gate driver sink peak current capability. Place decoupling capacitor close to the pin.
GND 9 P Input power supply and logic ground reference
IN+ 10 I Non-inverting gate driver control input. Tie to VCC if unused.
IN– 11 I Inverting gate driver control input. Tie to GND if unused.
RDY 12 O Power good for VCC-GND and VDD-COM. RDY is open drain configuration and can be paralleled with other RDY signals
FLT 13 O Active low fault alarm output upon overcurrent or short circuit. FLT is in open drain configuration and can be paralleled with other faults
RST/EN 14 I The RST/EN serves two purposes:
1) Enable / shutdown of the output side. The FET is turned off by a regular turn-off, if terminal EN is set to low;
2) Resets the OC condition signaled on FLT pin. if terminal RST/EN is set to low for more than 1000 ns. A reset of signal FLT is asserted at the rising edge of terminal RST/EN.
For automatic RESET function, this pin only serves as an EN pin. Enable / shutdown of the output side. The FET is turned off by a general turn-off, if terminal EN is set to low.
VCC 15 P Input power supply from 3 V to 5.5 V, bypassing a >1-μF capacitor to GND. Place decoupling capacitor close to the pin.
APWM 16 O Isolated Analog Sensing PWM output. Leave floating if unused.
(1) P = Power, G = Ground, I = Input, O = Output
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