ZHCSWL7C November   2008  – October 2024 TS3USB221A

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Dynamic Electrical Characteristics, VCC = 3.3V ±10%
    7. 5.7  Dynamic Electrical Characteristics, VCC = 2.5V ±10%
    8. 5.8  Switching Characteristics, VCC = 3.3V ±10%
    9. 5.9  Switching Characteristics, VCC = 2.5V ±10%
    10. 5.10 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Low Power Mode
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 接收文档更新通知
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 静电放电警告
    5. 9.5 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Revision History

Changes from Revision B (July 2024) to Revision C (October 2024)

  • 特性 要点从 RON = 6ω(最大值)更改为 RON = 6Ω(最大值)Go
  • 特性 要点从 δrON = 0.2ω(典型值)更改为 ΔrON = 0.2Ω(典型值)Go

Changes from Revision A (February 2015) to Revision B (July 2024)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • 更新了特性 部分中的 ESD 性能测试条件Go
  • Changed CDM test conditions in the ESD Ratings table from: per JEDEC specification JESD22-C101 to: per ANSI/ESDA/JEDEC JS-002Go
  • Added footnote to the VI/O parameter in the Recommended Operating Conditions tableGo
  • Changed RSE (UQFN) junction-to-ambient thermal resistance value from: 179.7°C/W to: 204.8°C/WGo
  • Changed RSE (UQFN) junction-to-case (top) thermal resistance value from: 107.9°C/W to: 118.1°C/WGo
  • Changed RSE (UQFN) junction-to-board thermal resistance value from: 100.7°C/W to: 121.5°C/WGo
  • Changed RSE (UQFN) junction-to-top characterization parameter value from: 7.1°C/W to: 13.9°C/WGo
  • Changed RSE (UQFN) junction-to-board characterization parameter value from: 100.0°C/W to: 121.2°C/WGo
  • Changed the VIK value in the Electrical Characteristics table from: –1.8V maximum to: –1.8V minimumGo
  • Changed the Typical Characteristics sectionGo

Changes from Revision * (November 2008) to Revision A (February 2015)

  • 添加了“ESD 等级”表、“特性说明”部分、“器件功能模式”、“应用和实施”部分、“电源相关建议”部分、“布局”部分、“器件和文档支持”部分以及“机械、封装和可订购信息”部分Go
  • 删除了数据表中的订购信息 表。如需了解订购信息,请参阅机械、封装和可订购信息 部分Go
  • 将文档按全新 TI 数据表标准进行了更新Go