ZHCU741 July   2020

 

  1.   说明
  2.   资源
  3.   特性
  4.   应用
  5.   5
  6. 1System Description
  7. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
      1. 2.2.1 PCB Assembly
      2. 2.2.2 Top Side of PCB Assembly
    3. 2.3 Highlighted Products
      1. 2.3.1 TPS92682-Q1
      2. 2.3.2 TPS92682-Q1
      3. 2.3.3 TPS92520-Q1
      4. 2.3.4 MSP432
      5. 2.3.5 System Design Theory
  8. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
      1. 3.1.1 CISPR 25 Class 5 Test Setup
      2. 3.1.2 LED Load Board Top
      3. 3.1.3 LED Load Board Bottom
    2. 3.2 Test Setup
    3. 3.3 Test Results
      1. 3.3.1  Boost Turn on Delay
      2. 3.3.2  Highbeam/Lowbeam Turn on Delay
      3. 3.3.3  Highbeam/Lowbeam Switch Node and Ripple Current
      4. 3.3.4  Turn Indicator Turn on Delay
      5. 3.3.5  Turn Indictor Turn Off Delay
      6. 3.3.6  Turn Indicator 1.5 Hz Operation
      7. 3.3.7  Turn Indicator Output Voltage and Current
      8. 3.3.8  Daytime Running Light Turn-on Delay
      9. 3.3.9  Daytime Running Light Switch Node and Output Current
      10. 3.3.10 Highbeam/Lowbeam LED Short
      11. 3.3.11 Highbeam/Lowbeam Fault Indicator
      12. 3.3.12 Turn Indicator Fault Output
      13. 3.3.13 TPS92682-Q1 Boost and SEPIC Interleaving
      14. 3.3.14 TIDA-050040 Full Load Efficiency
      15. 3.3.15 Efficiency Highbeam/Lowbeam
      16. 3.3.16 Efficiency Turn Indicator and Daytime Running Light
      17. 3.3.17 Efficiency Highbeam/Lowbeam and Turn Indicator
      18. 3.3.18 CISPR 25 Class 5 EMI Scan
      19. 3.3.19 Top Side Thermal Image DRL at 15W
      20. 3.3.20 Bottom side thermal image DRL at 15W
      21. 3.3.21 Top Side Thermal Image Highbeam/Lowbeam at 30W, Turn Indicator at 7.5W average
      22. 3.3.22 Bottom Side Thermal Image Highbeam/Lowbeam at 30W, Turn Indicator at 7.5W average
  9. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 BOM
    2. 4.2 Documentation Support
    3. 4.3 Support Resources
    4. 4.4 Trademarks

2.2.2 Top Side of PCB Assembly

Thermal pad can be used to conduct heat to an enclosure to remove heat from this side of the printed circuit board.

GUID-20200626-SS0I-QHTQ-P7VC-ZFGVL9TFJCFB-low.png
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