米6体育平台手机版_好二三四详情

Technology family AC Function Encoder, Multiplexer Configuration 2:1 Number of channels 4 Operating temperature range (°C) -40 to 85 Rating Catalog
Technology family AC Function Encoder, Multiplexer Configuration 2:1 Number of channels 4 Operating temperature range (°C) -40 to 85 Rating Catalog
PDIP (N) 20 228.702 mm² 24.33 x 9.4 SOIC (DW) 20 131.84 mm² 12.8 x 10.3 TSSOP (PW) 20 41.6 mm² 6.5 x 6.4
  • 3-State Outputs Interface Directly With System Bus
  • Flow-Through Architecture Optimizes PCB Layout
  • Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise
  • 500-mA Typical Latch-Up Immunity at 125°C
  • Provides Bus Interface From Multiple Sources in High-Performance Systems
  • 3-State Outputs Interface Directly With System Bus
  • Flow-Through Architecture Optimizes PCB Layout
  • Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise
  • 500-mA Typical Latch-Up Immunity at 125°C
  • Provides Bus Interface From Multiple Sources in High-Performance Systems

This device is designed to multiplex signals from 4-bit data sources to four output data lines in bus-organized systems. The 3-state outputs do not load the data lines when the output-enable (OE\) input is at a high logic level.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

This device is designed to multiplex signals from 4-bit data sources to four output data lines in bus-organized systems. The 3-state outputs do not load the data lines when the output-enable (OE\) input is at a high logic level.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

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类型 标题 下载最新的英语版本 日期
* 数据表 74AC11257 数据表 (Rev. C) 2004年 5月 21日

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

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