可提供此米6体育平台手机版_好二三四的更新版本
功能与比较器件相同,但引脚排列有所不同
ADC08L060
- Single-ended input
- Internal sample-and-hold function
- Low voltage (single +3V) operation
- Small package
- Power-down feature
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Key Specifications
- Resolution 8 bits
- Conversion rate 60 MSPS
- DNL ±0.25 LSB (typ)
- INL +0.5/−0.2 LSB (typ)
- SNR (10.1 MHz) 48 dB (typ)
- ENOB (10.1 MHz) 7.6 bits (typ)
- THD (10.1 MHz) −57 dB (typ)
- Latency 5 Clock Cycles
- No missing codes Ensured
- Power Consumption
- Operating 0.65 mW/MSPS (typ)
- Power Down Mode 1.0 mW (typ)
The ADC08L060 is a low-power, 8-bit, monolithic analog-to-digital converter with an on-chip track-and-hold circuit. Optimized for low cost, low power, small size and ease of use, this product operates at conversion rates of 10 MSPS to 60 MSPS while consuming just 0.65 mW per MHz of clock frequency, or 39 mW at 60 MSPS. Raising the PD pin puts the ADC08L060 into a Power Down mode where it consumes about 1 mW.
The unique architecture achieves 7.6 Effective Bits. The ADC08L060 is resistant to latch-up and the outputs are short-circuit proof. The top and bottom of the ADC08L060s reference ladder are available for connections, enabling a wide range of input possibilities. The digital outputs are TTL/CMOS compatible with a separate output power supply pin to support interfacing with 1.8V to 3V logic. The output coding is straight binary and the digital inputs (CLK and PD) are TTL/CMOS compatible.
The ADC08L060 is offered in a 24-lead plastic package (TSSOP) and is specified over the industrial temperature range of −40°C to +85°C.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | 8-Bit, 10 MSPS to 60 MSPS, 0.65 mW/MSPS A/D Converter w/Inter Sam-and-Hold 数据表 (Rev. G) | 2013年 3月 15日 |
设计和开发
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PSPICE-FOR-TI — 适用于 TI 设计和模拟工具的 PSpice®
借助 PSpice for TI 的设计和仿真环境及其内置的模型库,您可对复杂的混合信号设计进行仿真。创建完整的终端设备设计和原型解决方案,然后再进行布局和制造,可缩短米6体育平台手机版_好二三四上市时间并降低开发成本。
在 PSpice for TI 设计和仿真工具中,您可以搜索 TI (...)
封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
TSSOP (PW) | 24 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点