BQ24013
- Small 3-mm × 3-mm MLP (QFN) Package
- Ideal for Low-Dropout Designs for Single-Cell Li-Ion
or Li-Pol Packs in Space Limited Applications - Integrated Power FET and Current Sensor for Up to 1-A
Charge Applications - Reverse Leakage Protection Prevents Battery Drainage
- Integrated Current and Voltage Regulation
- ±0.5% Voltage Regulation Accuracy
- Charge Termination by Minimum Current and Time
- Pre-Charge Conditioning With Safety Timer
- Status Outputs for LED or System Interface Indicates
Charge and Fault Conditions - Battery Insertion and Removal Detection
- Works With Regulated and Unregulated Supplies
- Short-Circuit Protection
- Charge Voltage Options: 4.2 V and 4.36 V
The bqTINY™ series are highly integrated Li-Ion and Li-Pol linear charge management devices targeted at space limited portable applications. The bqTINY™ series offer integrated powerFET and current sensor, reverse blocking protection, high accuracy current and voltage regulation, charge status, and charge termination, in a small package.
The bqTINY™ charges the battery in three phases: conditioning, constant current, and constant voltage. Charge is terminated based on minimum current. An internal charge timer provides a backup safety feature for charge termination. The bqTINY™ automatically restarts the charge if the battery voltage falls below an internal threshold. The bqTINY™ automatically enters sleep mode when VCC supply is removed.
In addition to the standard features, different versions of the bqTINY™ offer a multitude of additional features. These include temperature sensing input for detecting hot or cold battery packs; power good (PG) output indicating the presence of valid input power; a TTL-level charge-enable input (CE) used to disable or enable the charge process; and a TTL-level timer and termination enable (TTE) input used to disable or enable the fast-charge timer and charge termination.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | Single-Chip, Li-Ion Charge Management IC For Handheld Applications (bqTINY) 数据表 (Rev. K) | 2014年 1月 27日 | |||
应用手册 | QFN 和 SON PCB 连接 (Rev. C) | PDF | HTML | 英语版 (Rev.C) | PDF | HTML | 2024年 1月 5日 |
设计和开发
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封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
VSON (DRC) | 10 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点
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