米6体育平台手机版_好二三四详情

Technology family CD4000 Supply voltage (min) (V) 3 Supply voltage (max) (V) 18 Number of channels 3 Inputs per channel 3 IOL (max) (mA) 6.8 IOH (max) (mA) -6.8 Input type Standard CMOS Output type Push-Pull Features Standard speed (tpd > 50ns) Data rate (max) (Mbps) 8 Rating Catalog Operating temperature range (°C) -55 to 125
Technology family CD4000 Supply voltage (min) (V) 3 Supply voltage (max) (V) 18 Number of channels 3 Inputs per channel 3 IOL (max) (mA) 6.8 IOH (max) (mA) -6.8 Input type Standard CMOS Output type Push-Pull Features Standard speed (tpd > 50ns) Data rate (max) (Mbps) 8 Rating Catalog Operating temperature range (°C) -55 to 125
PDIP (N) 14 181.42 mm² 19.3 x 9.4 SOIC (D) 14 51.9 mm² 8.65 x 6 SOP (NS) 14 79.56 mm² 10.2 x 7.8 TSSOP (PW) 14 32 mm² 5 x 6.4
  • Medium-Speed Operation - tPLH, tPHL = 60 ns (typ.) at VDD = 10 V
  • 100% tested for quiescent current at 20 V
  • Maximum input current of 1 µA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C
  • Standardized, symmetrical output characteristics
  • Noise margin (full package-temperature range):
         1 V at VDD = 5 V
         2 V at VDD = 10 V
      2.5 V at VDD = 15 V
  • 5-V, 10-V, and 15-V parametric ratings
  • Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of ’B’ Series CMOS Devices"

Data sheet acquired from Harris Semiconductor

  • Medium-Speed Operation - tPLH, tPHL = 60 ns (typ.) at VDD = 10 V
  • 100% tested for quiescent current at 20 V
  • Maximum input current of 1 µA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C
  • Standardized, symmetrical output characteristics
  • Noise margin (full package-temperature range):
         1 V at VDD = 5 V
         2 V at VDD = 10 V
      2.5 V at VDD = 15 V
  • 5-V, 10-V, and 15-V parametric ratings
  • Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of ’B’ Series CMOS Devices"

Data sheet acquired from Harris Semiconductor

CD4071B, CD4072B and CD4075B OR gates provide the system designer with direct implementation of the positive-logic OR function and supplement the existing family of CMOS gates.

The CD4071B, CD4072B, and CD4075B types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes) and 14-lead thin shrink small-outline packages (PW and PWR suffixes).

CD4071B, CD4072B and CD4075B OR gates provide the system designer with direct implementation of the positive-logic OR function and supplement the existing family of CMOS gates.

The CD4071B, CD4072B, and CD4075B types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes) and 14-lead thin shrink small-outline packages (PW and PWR suffixes).

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类型 标题 下载最新的英语版本 日期
* 数据表 CD4071B, CD4072B, CD4075B TYPES 数据表 (Rev. D) 2003年 8月 21日
选择指南 Logic Guide (Rev. AB) 2017年 6月 12日
应用手册 Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
选择指南 逻辑器件指南 2014 (Rev. AA) 最新英语版本 (Rev.AB) 2014年 11月 17日
用户指南 LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
应用手册 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
用户指南 Signal Switch Data Book (Rev. A) 2003年 11月 14日
应用手册 Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics 2001年 12月 3日

设计和开发

如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。

评估板

14-24-LOGIC-EVM — 采用 14 引脚至 24 引脚 D、DB、DGV、DW、DYY、NS 和 PW 封装的逻辑米6体育平台手机版_好二三四通用评估模块

14-24-LOGIC-EVM 评估模块 (EVM) 旨在支持采用 14 引脚至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。

用户指南: PDF | HTML
英语版 (Rev.B): PDF | HTML
TI.com 上无现货
仿真模型

CD4075B PSPICE Model (Rev. A)

SCHM012A.ZIP (7 KB) - PSpice Model
封装 引脚 CAD 符号、封装和 3D 模型
PDIP (N) 14 Ultra Librarian
SOIC (D) 14 Ultra Librarian
SOP (NS) 14 Ultra Librarian
TSSOP (PW) 14 Ultra Librarian

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

支持和培训

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