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CD74AC10

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3 通道、3 输入、1.5V 至 5.5V 与非门

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数据表

CD74AC10

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数据表 立即订购

米6体育平台手机版_好二三四详情

Technology family AC Supply voltage (min) (V) 1.5 Supply voltage (max) (V) 5.5 Number of channels 3 Inputs per channel 3 IOL (max) (mA) 24 IOH (max) (mA) -24 Input type Standard CMOS Output type Push-Pull Features Standard speed (tpd > 50ns) Data rate (max) (Mbps) 100 Rating Catalog Operating temperature range (°C) -55 to 125
Technology family AC Supply voltage (min) (V) 1.5 Supply voltage (max) (V) 5.5 Number of channels 3 Inputs per channel 3 IOL (max) (mA) 24 IOH (max) (mA) -24 Input type Standard CMOS Output type Push-Pull Features Standard speed (tpd > 50ns) Data rate (max) (Mbps) 100 Rating Catalog Operating temperature range (°C) -55 to 125
PDIP (N) 14 181.42 mm² 19.3 x 9.4 SOIC (D) 14 51.9 mm² 8.65 x 6
  • AC Types Feature 1.5-V to 5.5-V Operation and Balanced Noise Immunity at 30% of the Supply Voltage
  • Speed of Bipolar F, AS, and S, With Significantly Reduced Power Consumption
  • Balanced Propagation Delays
  • ±24-mA Output Drive Current
    • Fanout to 15 F Devices
  • SCR Latchup-Resistant CMOS Process and Circuit Design
  • Exceeds 2-kV ESD Protection Per MIL-STD-883, Method 3015
  • AC Types Feature 1.5-V to 5.5-V Operation and Balanced Noise Immunity at 30% of the Supply Voltage
  • Speed of Bipolar F, AS, and S, With Significantly Reduced Power Consumption
  • Balanced Propagation Delays
  • ±24-mA Output Drive Current
    • Fanout to 15 F Devices
  • SCR Latchup-Resistant CMOS Process and Circuit Design
  • Exceeds 2-kV ESD Protection Per MIL-STD-883, Method 3015

The CD74AC10 contains three independent 3-input NAND gates. This device performs the Boolean function Y = (A •B • C)\ or Y = A\ + B\ + C\ in positive logic.

The CD74AC10 contains three independent 3-input NAND gates. This device performs the Boolean function Y = (A •B • C)\ or Y = A\ + B\ + C\ in positive logic.
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类型 标题 下载最新的英语版本 日期
* 数据表 CD74AC10 数据表 2002年 11月 4日

订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

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