CD74HC40103
- Synchronous or Asynchronous Preset
- Cascadable in Synchronous or Ripple Mode
- Fanout (Over Temperature Range)
- Standard Outputs . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . 15 LSTTL Loads
- Wide Operating Temperature Range . . . –55°C to 125°C
- Balanced Propagation Delay and Transition Times
- Significant Power Reduction Compared to LSTTL Logic ICs
- HC Types
- 2V to 6V Operation
- High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V
- HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility, VIL = 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il 1µA at VOL, VOH
Data sheet acquired from Harris Semiconductor
The ’HC40103 and CD74HCT40103 are manufactured with high speed silicon gate technology and consist of an 8-stage synchronous down counter with a single output which is active when the internal count is zero. The 40103 contains a single 8-bit binary counter. Each has control inputs for enabling or disabling the clock, for clearing the counter to its maximum count, and for presetting the counter either synchronously or asynchronously. All control inputs and the TC\ output are active-low logic.
In normal operation, the counter is decremented by one count on each positive transition of the CLOCK (CP). Counting is inhibited when the TE\ input is high. The TC\ output goes low when the count reaches zero if the TE\ input is low, and remains low for one full clock period.
When the PE\ input is low, data at the P0-P7 inputs are clocked into the counter on the next positive clock transition regardless of the state of the TE\ input. When the PL\ input is low, data at the P0-P7 inputs are asynchronously forced into the counter regardless of the state of the PE\, TE\, or CLOCK inputs. Input P0-P7 represent a single 8-bit binary word for the 40103. When the MR input is low, the counter is asynchronously cleared to its maximum count of 25510, regardless of the state of any other input. The precedence relationship between control inputs is indicated in the truth table.
If all control inputs except TE\ are high at the time of zero count, the counters will jump to the maximum count, giving a counting sequence of 10016 or 25610 clock pulses long.
The 40103 may be cascaded using the TE\ input and the TC\ output, in either a synchronous or ripple mode. These circuits possess the low power consumption usually associated with CMOS circuitry, yet have speeds comparable to low power Schottky TTL circuits and can drive up to 10 LSTTL loads.
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功能与比较器件相同,但引脚排列有所不同
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | CD54HC40103, CD74HC40103, CD74HCT40103 数据表 (Rev. D) | 2003年 10月 16日 | |||
应用手册 | Implications of Slow or Floating CMOS Inputs (Rev. E) | 2021年 7月 26日 | ||||
选择指南 | Logic Guide (Rev. AB) | 2017年 6月 12日 | ||||
应用手册 | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015年 12月 2日 | ||||
选择指南 | 逻辑器件指南 2014 (Rev. AA) | 最新英语版本 (Rev.AB) | 2014年 11月 17日 | |||
用户指南 | LOGIC Pocket Data Book (Rev. B) | 2007年 1月 16日 | ||||
应用手册 | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 | ||||
用户指南 | Signal Switch Data Book (Rev. A) | 2003年 11月 14日 | ||||
应用手册 | TI IBIS File Creation, Validation, and Distribution Processes | 2002年 8月 29日 | ||||
应用手册 | CMOS Power Consumption and CPD Calculation (Rev. B) | 1997年 6月 1日 | ||||
应用手册 | 使用逻辑器件进行设计 (Rev. C) | 1997年 6月 1日 | ||||
应用手册 | Input and Output Characteristics of Digital Integrated Circuits | 1996年 10月 1日 | ||||
应用手册 | Live Insertion | 1996年 10月 1日 | ||||
应用手册 | SN54/74HCT CMOS Logic Family Applications and Restrictions | 1996年 5月 1日 | ||||
应用手册 | Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc | 1996年 4月 1日 |
设计和开发
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14-24-LOGIC-EVM — 采用 14 引脚至 24 引脚 D、DB、DGV、DW、DYY、NS 和 PW 封装的逻辑米6体育平台手机版_好二三四通用评估模块
14-24-LOGIC-EVM 评估模块 (EVM) 旨在支持采用 14 引脚至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。
封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
PDIP (N) | 16 | Ultra Librarian |
SOIC (D) | 16 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点