CD74HCT221
- Overriding RESET Terminates Output Pulse
- Triggering from the Leading or Trailing Edge
- Q and Q\ Buffered Outputs
- Separate Resets
- Wide Range of Output-Pulse Widths
- Schmitt Trigger on B Inputs
- Fanout (Over Temperature Range)
- Standard Outputs . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . 15 LSTTL Loads
- Wide Operating Temperature Range . . . –55°C to 125°C
- Balanced Propagation Delay and Transition Times
- Significant Power Reduction Compared to LSTTL Logic ICs
- HC Types
- 2V to 6V Operation
- High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V
- HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility, VIL = 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il 1µA at VOL, VOH
Data sheet acquired from Harris Semiconductor
The ’HC221 and CD74HCT221 are dual monostable multivibrators with reset. An external resistor (RX) and an external capacitor (CX) control the timing and the accuracy for the circuit. Adjustment of RX and CX provides a wide range of output pulse widths from the Q and Q\ terminals. Pulse triggering on the B input occurs at a particular voltage level and is not related to the rise and fall time of the trigger pulse.
Once triggered, the outputs are independent of further trigger inputs on A\ and B. The output pulse can be terminated by a LOW level on the Reset (R)\ pin. Trailing Edge triggering (A)\ and leading-edge-triggering (B) inputs are provided for triggering from either edge of the input pulse. On power up, the IC is reset. If either Mono is not used each input (on the unused device) must be terminated either high or low.
The minimum value of external resistance, RX, is typically 500. The minimum value of external capacitance, CX, is 0pF. The calculation for the pulse width is tW = 0.7 RXCX at VCC = 4.5V.
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功能与比较器件相同,且具有相同引脚
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | CD54HC221, CD74HC221, CD74HCT221 数据表 (Rev. F) | 2003年 10月 16日 |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点