CD74HCT574-EP
- Controlled Baseline
- One Assembly/Test Site, One Fabrication Site
- Extended Temperature Performance of –40°C to 125°C
- Enhanced Diminishing Manufacturing Sources (DMS) Support
- Enhanced Product Change Notification
- Qualification Pedigree
- Buffered Inputs
- Common 3-State Output-Enable Control
- 3-State Outputs
- Bus-Line Driving Capability
- Typical Propagation Delay (Clock to Q):
15 ns at VCC = 5 V, CL = 15 pF, TA = 25°C - Fanout (Over Temperature Range)
- Standard Outputs . . . 10 LSTTL Loads
- Bus Driver Outputs . . . 15 LSTTL Loads
- Balanced Propagation Delay and Transition Times
- Significant Power Reduction Compared to LSTTL Logic ICs
- VCC Voltage = 4.5 V to 5.5 V
- Direct LSTTL Input Logic Compatibility, VIL = 0.8 V (Max), VIH = 2 V (Min)
- CMOS Input Compatibility, Il ≤ 1 µA at VOL, VOH
Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
The CD74HCT574 is an octal D-type flip-flop with 3-state outputs and the capability to drive 15 LSTTL loads. The eight edge-triggered flip-flops enter data into their registers on the low-to-high transition of the clock (CP). The output enable (OE)\ controls the 3-state outputs and is independent of the register operation. When OE\ is high, the outputs are in the high-impedance state.
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技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | CD74HCT574-EP 数据表 | 2004年 2月 6日 | |||
* | VID | CD74HCT574-EP VID V6204739 | 2016年 6月 21日 | |||
应用手册 | Power-Up Behavior of Clocked Devices (Rev. B) | PDF | HTML | 2022年 12月 15日 | |||
应用手册 | Implications of Slow or Floating CMOS Inputs (Rev. E) | 2021年 7月 26日 | ||||
选择指南 | Logic Guide (Rev. AB) | 2017年 6月 12日 | ||||
应用手册 | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015年 12月 2日 | ||||
选择指南 | 逻辑器件指南 2014 (Rev. AA) | 最新英语版本 (Rev.AB) | 2014年 11月 17日 | |||
用户指南 | LOGIC Pocket Data Book (Rev. B) | 2007年 1月 16日 | ||||
应用手册 | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 | ||||
用户指南 | Signal Switch Data Book (Rev. A) | 2003年 11月 14日 | ||||
应用手册 | TI IBIS File Creation, Validation, and Distribution Processes | 2002年 8月 29日 | ||||
应用手册 | CMOS Power Consumption and CPD Calculation (Rev. B) | 1997年 6月 1日 | ||||
应用手册 | 使用逻辑器件进行设计 (Rev. C) | 1997年 6月 1日 | ||||
应用手册 | SN54/74HCT CMOS Logic Family Applications and Restrictions | 1996年 5月 1日 | ||||
应用手册 | Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc | 1996年 4月 1日 |
设计和开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
SOIC (DW) | 20 | Ultra Librarian |
TSSOP (PW) | 20 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点