LMH6715
- TA = 25°C, RL = 100Ω, Typical Values Unless Specified.
- Very Low Diff. Gain, Phase: 0.02%, 0.02°
- Wide Bandwidth: 480MHz (AV = +1V/V); 400MHz (AV = +2V/V)
- 0.1dB Gain Flatness to 100MHz
- Low Power: 5.8mA/Channel
- −70dB Channel-to-Channel Crosstalk (10MHz)
- Fast Slew Rate: 1300V/μs
- Unity Gain Stable
- Improved Replacement for CLC412
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The LMH6715 combines TI's VIP10 high speed complementary bipolar process with TI's current feedback topology to produce a very high speed dual op amp. The LMH6715 provides 400MHz small signal bandwidth at a gain of +2V/V and 1300V/μs slew rate while consuming only 5.8mA per amplifier from ±5V supplies.
The LMH6715 offers exceptional video performance with its 0.02% and 0.02° differential gain and phase errors for NTSC and PAL video signals while driving up to four back terminated 75Ω loads. The LMH6715 also offers a flat gain response of 0.1dB to 100MHz and very low channel-to-channel crosstalk of −70dB at 10MHz. Additionally, each amplifier can deliver 70mA of output current. This level of performance makes the LMH6715 an ideal dual op amp for high density, broadcast quality video systems.
The LMH6715's two very well matched amplifiers support a number of applications such as differential line drivers and receivers. In addition, the LMH6715 is well suited for Sallen Key active filters in applications such as anti-aliasing filters for high speed A/D converters. Its small 8-pin SOIC package, low power requirement, low noise and distortion allow the LMH6715 to serve portable RF applications such as IQ channels.
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技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | LMH6715 Dual Wideband Video Op Amp 数据表 (Rev. C) | 2013年 4月 22日 | |||
技术文章 | 3 common questions when designing with high-speed amplifiers | PDF | HTML | 2020年 7月 17日 | |||
电子书 | The Signal e-book: 有关运算放大器设计主题的博客文章汇编 | 英语版 | 2018年 1月 31日 |
设计和开发
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封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
SOIC (D) | 8 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点