MAX3232-EP
- RS-232 Bus-Pin ESD Protection Exceeds
±15 kV Using Human-Body Model (HBM) - Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards
- Operates With 3-V to 5.5-V VCC Supply
- Operates Up To 250 kbit/s
- Two Drivers and Two Receivers
- Low Supply Current . . . 300 µA Typical
- External Capacitors . . . 4 × 0.1 µF
- Accepts 5-V Logic Input With 3.3-V Supply
- Alternative High-Speed Pin-Compatible Device (1 Mbit/s)
- SNx5C3232
- SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS
- Controlled Baseline
- One Assembly/Test Site
- One Fabrication Site
- Available in Military (–55°C/125°C) Temperature Range(1)
- Extended Product Life Cycle
- Extended Product-Change Notification
- Product Traceability
- APPLICATIONS
- Battery-Powered Systems, PDAs, Notebooks, Laptops,
Palmtop PCs, and Hand-Held Equipment
- Battery-Powered Systems, PDAs, Notebooks, Laptops,
(1) Additional temperature ranges are available - contact factory
The MAX3232 device consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The devices operate at data signaling rates up to 250 kbit/s and a maximum of 30-V/µs driver output slew rate.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | 3-V to 5.5-V Multichannel RS-232 Line Driver/Receiver w/+/-15-kV ESD 数据表 (Rev. A) | 2009年 3月 23日 | |||
* | VID | MAX3232-EP VID V6206623 | 2016年 6月 21日 | |||
* | 辐射与可靠性报告 | MAX3232MDBREP Reliability Report | 2016年 1月 13日 | |||
* | 辐射与可靠性报告 | MAX3232MPWREP Reliability Report | 2016年 1月 13日 |
设计和开发
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封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
SSOP (DB) | 16 | Ultra Librarian |
TSSOP (PW) | 16 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点
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