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SN5407

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具有 30V 容限集电极开路输出的军用六通道、4.5V 至 5.5V 双极性缓冲器

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SN5407

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米6体育平台手机版_好二三四详情

Technology family TTL Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 6 IOL (max) (mA) 30 Supply current (max) (µA) 41000 IOH (max) (mA) 0.25 Input type Bipolar Output type Open-collector Features High speed (tpd 10-50ns) Rating Military Operating temperature range (°C) -55 to 125
Technology family TTL Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 6 IOL (max) (mA) 30 Supply current (max) (µA) 41000 IOH (max) (mA) 0.25 Input type Bipolar Output type Open-collector Features High speed (tpd 10-50ns) Rating Military Operating temperature range (°C) -55 to 125
CDIP (J) 14 130.4652 mm² 19.56 x 6.67 CFP (W) 14 58.023 mm² 9.21 x 6.3 LCCC (FK) 20 79.0321 mm² 8.89 x 8.89
  • Convert TTL Voltage Levels to MOS Levels
  • High Sink-Current Capability Design
  • Open-Collector Driver for Indicator Lamps
  • Inputs Fully Compatible With Most TTL Circuits
  • On Products Compliant to MIL-PRF-38535, All Parameters Are Tested Unless Otherwise Noted. On All Other Products, Production Processing Does Not Necessarily Include Testing of All Parameters.
  • Convert TTL Voltage Levels to MOS Levels
  • High Sink-Current Capability Design
  • Open-Collector Driver for Indicator Lamps
  • Inputs Fully Compatible With Most TTL Circuits
  • On Products Compliant to MIL-PRF-38535, All Parameters Are Tested Unless Otherwise Noted. On All Other Products, Production Processing Does Not Necessarily Include Testing of All Parameters.

These TTL hex buffers and drivers feature high-voltage open-collector outputs for interfacing with high-level circuits (such as MOS) or for driving high-current loads (such as lamps or relays), and also are characterized for use as buffers for driving TTL inputs. The SN5407 and SN7407 devices have minimum breakdown voltages of 30 V, and the SN5417 and SN7417 devices have minimum breakdown voltages of 15 V. The maximum sink current is 30 mA for the SN5407 and SN5417 devices and 40 mA for the SN7407 and SN7417 devices.

These devices perform the Boolean function Y = A in positive logic.

These circuits are completely compatible with most TTL families. Inputs are diode clamped to minimize transmission-line effects, which simplifies design. Typical power dissipation is 145 mW, and average propagation delay time is 14 ns.

These TTL hex buffers and drivers feature high-voltage open-collector outputs for interfacing with high-level circuits (such as MOS) or for driving high-current loads (such as lamps or relays), and also are characterized for use as buffers for driving TTL inputs. The SN5407 and SN7407 devices have minimum breakdown voltages of 30 V, and the SN5417 and SN7417 devices have minimum breakdown voltages of 15 V. The maximum sink current is 30 mA for the SN5407 and SN5417 devices and 40 mA for the SN7407 and SN7417 devices.

These devices perform the Boolean function Y = A in positive logic.

These circuits are completely compatible with most TTL families. Inputs are diode clamped to minimize transmission-line effects, which simplifies design. Typical power dissipation is 145 mW, and average propagation delay time is 14 ns.
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类型 标题 下载最新的英语版本 日期
* 数据表 SNx407 and SNx417 Hex Buffers and Drivers With Open-Collector High-Voltage Outputs 数据表 (Rev. H) PDF | HTML 2016年 9月 27日
选择指南 Logic Guide (Rev. AB) 2017年 6月 12日
应用手册 Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
选择指南 逻辑器件指南 2014 (Rev. AA) 最新英语版本 (Rev.AB) 2014年 11月 17日
用户指南 LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
应用手册 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
应用手册 使用逻辑器件进行设计 (Rev. C) 1997年 6月 1日
应用手册 Input and Output Characteristics of Digital Integrated Circuits 1996年 10月 1日
应用手册 Live Insertion 1996年 10月 1日

设计和开发

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封装 引脚 CAD 符号、封装和 3D 模型
CDIP (J) 14 Ultra Librarian
CFP (W) 14 Ultra Librarian
LCCC (FK) 20 Ultra Librarian
应遵守 TI 评估类商品的标准条款与条件。

订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

支持和培训

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