SN74ABT240A
- Typical VOLP (Output Ground Bounce)
<1 V at VCC = 5 V, TA = 25°C - High-Drive Outputs (–32-mA IOH, 64-mA IOL)
- Ioff Supports Partial-Power-Down Mode Operation
- Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Together with the SN54ABT241, SN74ABT241A, SN54ABT244, and SN74ABT244A, these devices provide the choice of selected combinations of inverting and noninverting outputs, symmetrical active-low output-enable (OE)\ inputs, and complementary OE and OE\ inputs.
The SN54ABT240 and SN74ABT240A are organized as two 4-bit buffers/line drivers with separate OE\ inputs. When OE\ is low, the devices pass inverted data from the A inputs to the Y outputs. When OE\ is high, the outputs are in the high-impedance state.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
您可能感兴趣的相似米6体育平台手机版_好二三四
功能优于所比较器件的普遍直接替代米6体育平台手机版_好二三四
功能与比较器件相同,但引脚排列有所不同
技术文档
设计和开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
14-24-LOGIC-EVM — 采用 14 引脚至 24 引脚 D、DB、DGV、DW、DYY、NS 和 PW 封装的逻辑米6体育平台手机版_好二三四通用评估模块
14-24-LOGIC-EVM 评估模块 (EVM) 旨在支持采用 14 引脚至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。
封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
PDIP (N) | 20 | Ultra Librarian |
SOIC (DW) | 20 | Ultra Librarian |
SOP (NS) | 20 | Ultra Librarian |
SSOP (DB) | 20 | Ultra Librarian |
TSSOP (PW) | 20 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点