米6体育平台手机版_好二三四详情

Technology family AHC Supply voltage (min) (V) 2 Supply voltage (max) (V) 5.5 Number of channels 6 IOL (max) (mA) 8 IOH (max) (mA) 0 Supply current (max) (µA) 20 Input type Standard CMOS Output type Open-drain Features Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 85
Technology family AHC Supply voltage (min) (V) 2 Supply voltage (max) (V) 5.5 Number of channels 6 IOL (max) (mA) 8 IOH (max) (mA) 0 Supply current (max) (µA) 20 Input type Standard CMOS Output type Open-drain Features Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 85
PDIP (N) 14 181.42 mm² 19.3 x 9.4 SOIC (D) 14 51.9 mm² 8.65 x 6 SSOP (DB) 14 48.36 mm² 6.2 x 7.8 TSSOP (PW) 14 32 mm² 5 x 6.4
  • Operating Range 2-V to 5.5-V VCC
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

  • Operating Range 2-V to 5.5-V VCC
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

The ’AHC05 devices contain six independent inverters. These devices perform the Boolean function Y = A\.

The open-drain outputs require pullup resistors to perform correctly. They can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions.

The ’AHC05 devices contain six independent inverters. These devices perform the Boolean function Y = A\.

The open-drain outputs require pullup resistors to perform correctly. They can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions.

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类型 标题 下载最新的英语版本 日期
* 数据表 SN54AHC05, SN74AHC05 数据表 (Rev. H) 2003年 7月 1日

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

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