SN74AUP1G79
- Available in the Texas Instruments NanoStar™ Package
- Low Static-Power Consumption:
ICC = 0.9 µA Maximum - Low Dynamic-Power Consumption:
Cpd = 3 pF Typical at 3.3 V - Low Input Capacitance:
Ci = 1.5 pF Typical - Low Noise: Overshoot and Undershoot
< 10% of VCC - Ioff Supports Partial Power-Down-Mode Operation
- Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at the Input
(Vhys = 250 mV Typical at 3.3 V) - Wide Operating VCC Range of 0.8 V to 3.6 V
- Optimized for 3.3-V Operation
- 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
- tpd = 4 ns Maximum at 3.3 V
- Suitable for Point-to-Point Applications
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model
(A114-B, Class II) - 1000-V Charged-Device Model (C101)
- 2000-V Human-Body Model
The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family assures a very-low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, thus resulting in an increased battery life. The AUP devices also maintain excellent signal integrity.
The SN74AUP1G79 is a single positive-edge-triggered D-type flip-flop. When data at the data (D) input meets the setup-time requirement, the data is transferred to the Q output on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
The SN74AUP1G79 device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.
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技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | SN74AUP1G79 Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop 数据表 (Rev. I) | PDF | HTML | 2017年 9月 6日 | ||
应用手册 | Power-Up Behavior of Clocked Devices (Rev. B) | PDF | HTML | 2022年 12月 15日 | |||
应用简报 | 了解施密特触发器 (Rev. A) | PDF | HTML | 英语版 (Rev.A) | PDF | HTML | 2022年 12月 1日 | |
选择指南 | Little Logic Guide 2018 (Rev. G) | 2018年 7月 6日 | ||||
应用手册 | Designing and Manufacturing with TI's X2SON Packages | 2017年 8月 23日 | ||||
选择指南 | Logic Guide (Rev. AB) | 2017年 6月 12日 | ||||
应用手册 | How to Select Little Logic (Rev. A) | 2016年 7月 26日 | ||||
选择指南 | 逻辑器件指南 2014 (Rev. AA) | 最新英语版本 (Rev.AB) | 2014年 11月 17日 | |||
选择指南 | 小尺寸逻辑器件指南 (Rev. E) | 最新英语版本 (Rev.G) | 2012年 7月 16日 | |||
应用手册 | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 |
设计和开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑评估模块
封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
SOT-23 (DBV) | 5 | Ultra Librarian |
SOT-5X3 (DRL) | 5 | Ultra Librarian |
SOT-SC70 (DCK) | 5 | Ultra Librarian |
USON (DRY) | 6 | Ultra Librarian |
X2SON (DPW) | 5 | Ultra Librarian |
X2SON (DSF) | 6 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点