SN74AUP2G17
- Available in the Texas Instruments NanoStar&trade Package
- Low Static-Power Consumption
(ICC = 0.9 µA Maximum) - Low Dynamic-Power Consumption
(Cpd = 4.3 pF Typical at 3.3 V) - Low Input Capacitance (Ci = 1.5 pF Typical)
- Low Noise – Overshoot and Undershoot
<10% of VCC - Ioff Supports Partial-Power-Down Mode Operation
- Wide Operating VCC Range of 0.8 V to 3.6 V
- Optimized for 3.3-V Operation
- 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
- tpd = 5.1 ns Maximum at 3.3 V
- Suitable for Point-to-Point Applications
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model
(A114-B, Class II) - 1000-V Charged-Device Model (C101)
- 2000-V Human-Body Model
NanoStar is a trademark of Texas Instruments
The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).
The SN74AUP2G17 contains two buffers and performs the Boolean function Y = A. The device functions as two independent buffers, but because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
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功能与比较器件相同,且具有相同引脚
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | SN74AUP2G17 Low-Power Dual Schmitt-Trigger Buffer 数据表 (Rev. A) | 2010年 5月 11日 | |||
应用简报 | 了解施密特触发器 (Rev. A) | PDF | HTML | 英语版 (Rev.A) | PDF | HTML | 2022年 12月 1日 | |
选择指南 | Little Logic Guide 2018 (Rev. G) | 2018年 7月 6日 | ||||
选择指南 | Logic Guide (Rev. AB) | 2017年 6月 12日 | ||||
应用手册 | How to Select Little Logic (Rev. A) | 2016年 7月 26日 | ||||
选择指南 | 逻辑器件指南 2014 (Rev. AA) | 最新英语版本 (Rev.AB) | 2014年 11月 17日 | |||
选择指南 | 小尺寸逻辑器件指南 (Rev. E) | 最新英语版本 (Rev.G) | 2012年 7月 16日 | |||
应用手册 | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 |
设计和开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑评估模块
封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
DSBGA (YFP) | 6 | Ultra Librarian |
SOT-SC70 (DCK) | 6 | Ultra Librarian |
USON (DRY) | 6 | Ultra Librarian |
X2SON (DSF) | 6 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点