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SN74AUP3G14

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具有施密特触发输入的 3 通道、0.8V 至 3.6V 低功耗反相器

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SN74AUP3G14

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米6体育平台手机版_好二三四详情

Technology family AUP Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 3.6 Number of channels 3 IOL (max) (mA) 4 IOH (max) (mA) -4 Supply current (max) (µA) 10 Input type Schmitt-Trigger Output type Push-Pull Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 85
Technology family AUP Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 3.6 Number of channels 3 IOL (max) (mA) 4 IOH (max) (mA) -4 Supply current (max) (µA) 10 Input type Schmitt-Trigger Output type Push-Pull Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 85
DSBGA (YFP) 8 1.8 mm² 1 x 1.8 UQFN (RSE) 8 2.25 mm² 1.5 x 1.5 VSSOP (DCU) 8 6.2 mm² 2 x 3.1 X2SON (DQE) 8 1.4 mm² 1.4 x 1
  • Available in the Texas Instruments NanoStar Package
  • Low Static-Power Consumption
    (ICC = 0.9 µA Maximum)
  • Low Dynamic-Power Consumption
    (Cpd = 4.3 pF Typ at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typical)
  • Low Noise – Overshoot and Undershoot
    <10% of VCC
  • Ioff Supports Partial-Power-Down Mode Operation
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 4.3 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)

NanoStar is a trademark of Texas Instruments.
  • Available in the Texas Instruments NanoStar Package
  • Low Static-Power Consumption
    (ICC = 0.9 µA Maximum)
  • Low Dynamic-Power Consumption
    (Cpd = 4.3 pF Typ at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typical)
  • Low Noise – Overshoot and Undershoot
    <10% of VCC
  • Ioff Supports Partial-Power-Down Mode Operation
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 4.3 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)

NanoStar is a trademark of Texas Instruments.

The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity.

The SN74AUP3G14 contains three inverters and performs the Boolean function Y = A. The device functions as three independent inverters but, because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity.

The SN74AUP3G14 contains three inverters and performs the Boolean function Y = A. The device functions as three independent inverters but, because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
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类型 标题 下载最新的英语版本 日期
* 数据表 SN74AUP3G14 Low-Power Triple Schmitt-Trigger Inverter 数据表 (Rev. D) 2012年 8月 23日
应用简报 了解施密特触发器 (Rev. A) PDF | HTML 英语版 (Rev.A) PDF | HTML 2022年 12月 1日
选择指南 Little Logic Guide 2018 (Rev. G) 2018年 7月 6日
选择指南 Logic Guide (Rev. AB) 2017年 6月 12日
应用手册 How to Select Little Logic (Rev. A) 2016年 7月 26日
选择指南 逻辑器件指南 2014 (Rev. AA) 最新英语版本 (Rev.AB) 2014年 11月 17日
选择指南 小尺寸逻辑器件指南 (Rev. E) 最新英语版本 (Rev.G) 2012年 7月 16日
应用手册 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日

设计和开发

如需其他信息或资源，请点击以下任一标题进入详情页面查看（如有）。

评估板

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用户指南: PDF
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仿真模型

SN74AUP3G14 Behavioral SPICE Model

SCEM665.ZIP (7 KB) - PSpice Model
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参考设计

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设计指南: PDF
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TIDA-010005 — 软件可配置的心脏起搏器检测模块参考设计

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设计指南: PDF
原理图: PDF
封装 引脚 CAD 符号、封装和 3D 模型
DSBGA (YFP) 8 Ultra Librarian
UQFN (RSE) 8 Ultra Librarian
VSSOP (DCU) 8 Ultra Librarian
X2SON (DQE) 8 Ultra Librarian
应遵守 TI 评估类商品的标准条款与条件。

订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

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