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SN74BCT760-EP

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具有集电极开路输出的 8 通道、-0.5V 至 7V 缓冲器（增强型米6体育平台手机版_好二三四）

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SN74BCT760-EP

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米6体育平台手机版_好二三四详情

Technology family BCT Supply voltage (min) (V) -0.5 Supply voltage (max) (V) 7 Number of channels 8 IOL (max) (mA) 76 Supply current (max) (µA) 76 IOH (max) (mA) 0 Input type Bipolar Output type Open-collector Features High speed (tpd 10-50ns), Over-voltage tolerant inputs Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125
Technology family BCT Supply voltage (min) (V) -0.5 Supply voltage (max) (V) 7 Number of channels 8 IOL (max) (mA) 76 Supply current (max) (µA) 76 IOH (max) (mA) 0 Input type Bipolar Output type Open-collector Features High speed (tpd 10-50ns), Over-voltage tolerant inputs Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125
SOIC (DW) 20 131.84 mm² 12.8 x 10.3
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of -55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • Open-Collector Version of 'BCT244
  • Open-Collector Outputs Drive Bus Lines or Buffer Memory Address Registers
  • ESD Protection Exceeds 2000 V Per MIL-STD-883C Method 3015
  • Available In Plastic Small-Outline (DW) Package

(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified >performance and environmental limits.
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of -55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • Open-Collector Version of 'BCT244
  • Open-Collector Outputs Drive Bus Lines or Buffer Memory Address Registers
  • ESD Protection Exceeds 2000 V Per MIL-STD-883C Method 3015
  • Available In Plastic Small-Outline (DW) Package

(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified >performance and environmental limits.

The SN74BCT760 octal buffer and line driver is designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

The SN74BCT760 is organized as two 4-bit buffers/line drivers with separate output-enable (OE) inputs. When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state.

The device is characterized for operation over the full military temperature range of -55°C to 125°C.

The SN74BCT760 octal buffer and line driver is designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

The SN74BCT760 is organized as two 4-bit buffers/line drivers with separate output-enable (OE) inputs. When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state.

The device is characterized for operation over the full military temperature range of -55°C to 125°C.

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类型 标题 下载最新的英语版本 日期
* 数据表 SN74BCT760-EP 数据表 (Rev. B) 2006年 9月 7日
* VID SN74BCT760-EP VID V6206672 2016年 6月 21日
应用手册 Implications of Slow or Floating CMOS Inputs (Rev. E) 2021年 7月 26日
选择指南 Logic Guide (Rev. AB) 2017年 6月 12日
应用手册 Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
选择指南 逻辑器件指南 2014 (Rev. AA) 最新英语版本 (Rev.AB) 2014年 11月 17日
用户指南 LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
应用手册 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
应用手册 TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
应用手册 Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997年 8月 1日
应用手册 使用逻辑器件进行设计 (Rev. C) 1997年 6月 1日
应用手册 Input and Output Characteristics of Digital Integrated Circuits 1996年 10月 1日
应用手册 Live Insertion 1996年 10月 1日

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SOIC (DW) 20 Ultra Librarian
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订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

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