米6体育平台手机版_好二三四详情

Supply voltage (min) (V) 2 Supply voltage (max) (V) 6 Number of channels 8 IOL (max) (mA) 7.8 IOH (max) (mA) -7.8 Input type CMOS Output type CMOS Features Balanced outputs, High speed (tpd 10-50ns), Positive input clamp diode Technology family HC Rating Catalog Operating temperature range (°C) -40 to 85
Supply voltage (min) (V) 2 Supply voltage (max) (V) 6 Number of channels 8 IOL (max) (mA) 7.8 IOH (max) (mA) -7.8 Input type CMOS Output type CMOS Features Balanced outputs, High speed (tpd 10-50ns), Positive input clamp diode Technology family HC Rating Catalog Operating temperature range (°C) -40 to 85
SOIC (DW) 24 159.65 mm² 15.5 x 10.3
  • Wide Operating Voltage Range of 2 V to 6 V
  • High-Current 3-State Outputs Can Drive Up To 15 LSTTL Loads
  • Low Power Consumption, 80-µA Max ICC
  • Typical tpd = 11 ns
  • ±6-mA Output Drive at 5 V
  • Low Input Current of 1 µA Max
  • Independent Registers for A and B Buses
  • Multiplexed Real-Time and Stored Data
  • True Data Paths

  • Wide Operating Voltage Range of 2 V to 6 V
  • High-Current 3-State Outputs Can Drive Up To 15 LSTTL Loads
  • Low Power Consumption, 80-µA Max ICC
  • Typical tpd = 11 ns
  • ±6-mA Output Drive at 5 V
  • Low Input Current of 1 µA Max
  • Independent Registers for A and B Buses
  • Multiplexed Real-Time and Stored Data
  • True Data Paths

The ’HC646 devices consist of bus-transceiver circuits with 3-state outputs, D-type flip-flops, and control circuitry arranged for multiplexed transmission of data directly from the input bus or from the internal registers. Data on the A or B bus is clocked into the registers on the low-to-high transition of the appropriate clock (CLKAB or CLKBA) input. Figure 1 illustrates the four fundamental bus-management functions that can be performed with the ’HC646 devices.

Output-enable (OE)\ and direction-control (DIR) inputs control the transceiver functions. In the transceiver mode, data present at the high-impedance port may be stored in either or both registers.

The select-control (SAB and SBA) inputs can multiplex stored and real-time (transparent mode) data. DIR determines which bus receives data when OE\ is active (low). In the isolation mode (OE\ high), A data may be stored in one register and/or B data may be stored in the other register.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

When an output function is disabled, the input function is still enabled and can be used to store data. Only one of the two buses, A or B, may be driven at a time.

The ’HC646 devices consist of bus-transceiver circuits with 3-state outputs, D-type flip-flops, and control circuitry arranged for multiplexed transmission of data directly from the input bus or from the internal registers. Data on the A or B bus is clocked into the registers on the low-to-high transition of the appropriate clock (CLKAB or CLKBA) input. Figure 1 illustrates the four fundamental bus-management functions that can be performed with the ’HC646 devices.

Output-enable (OE)\ and direction-control (DIR) inputs control the transceiver functions. In the transceiver mode, data present at the high-impedance port may be stored in either or both registers.

The select-control (SAB and SBA) inputs can multiplex stored and real-time (transparent mode) data. DIR determines which bus receives data when OE\ is active (low). In the isolation mode (OE\ high), A data may be stored in one register and/or B data may be stored in the other register.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

When an output function is disabled, the input function is still enabled and can be used to store data. Only one of the two buses, A or B, may be driven at a time.

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类型 标题 下载最新的英语版本 日期
* 数据表 SN54HC646, SN74HC646 数据表 (Rev. C) 2003年 3月 18日

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

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