米6体育平台手机版_好二三四详情

Technology family LS Function Digital Multiplexer Configuration 2:1 Number of channels 4 Operating temperature range (°C) 0 to 70 Rating Catalog
Technology family LS Function Digital Multiplexer Configuration 2:1 Number of channels 4 Operating temperature range (°C) 0 to 70 Rating Catalog
PDIP (N) 16 181.42 mm² 19.3 x 9.4 SOIC (D) 16 59.4 mm² 9.9 x 6 SOP (NS) 16 79.56 mm² 10.2 x 7.8
  • Buffered Inputs and Outputs
  • Three Speed/Power Ranges Available
  • Applications
    • Expand Any Data Input Point
    • Multiplex Dual Data Buses
    • Generate Four Functions of Two Variables (One Variable Is Common)
    • Source Programmable Counters

  • Buffered Inputs and Outputs
  • Three Speed/Power Ranges Available
  • Applications
    • Expand Any Data Input Point
    • Multiplex Dual Data Buses
    • Generate Four Functions of Two Variables (One Variable Is Common)
    • Source Programmable Counters

These monolithic data selectors/multiplexers contain inverters and drivers to supply full on-chip data selection to the four output gates. A separate strobe input is provided. A 4-bit word is selected from one of two sources and is routed to the four outputs. The ’157, ’LS157, and ’S157 present true data whereas the ’LS158 and ’S158 present inverted data to minimize propagation delay time.

These monolithic data selectors/multiplexers contain inverters and drivers to supply full on-chip data selection to the four output gates. A separate strobe input is provided. A 4-bit word is selected from one of two sources and is routed to the four outputs. The ’157, ’LS157, and ’S157 present true data whereas the ’LS158 and ’S158 present inverted data to minimize propagation delay time.

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CD74ACT157 正在供货 四路同向双输入多路复用器 Shorter average propagation delay (8ns), higher average drive strength (24mA)

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类型 标题 下载最新的英语版本 日期
* 数据表 SN54157, SN54LS157, SN54LS158, SN54S157, SN54S158, SN74157, SN74LS157, SN74LS158 数据表 (Rev. A) 1974年 3月 1日

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

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