SN74LS166A
- Synchronous Load
- Direct Overriding Clear
- Parallel to Serial Conversion
The '166 and 'LS166A 8-bit shift registers are compatible with most other TTL logic families. All '166 and 'LS166A inputs are buffered to lower the drive requirements to one Series 54/74 or Series 54LS/74LS standard load, respectively. Input clamping diodes minimize switching transients and simplify system design.
These parallel-in or serial-in, serial-out shift registers have a complexity of 77 equivalent gates on a monolithic chip. They feature gated clock inputs and an overriding clear input. The parallel-in or serial-in modes are established by the shift/load input. When high, this input enables the serial data input and couples the eight flip-flops for serial shifting with each clock pulse. When low, the parallel (broadside) data inputs are enabled and synchronous loading occurs on the next clock pulse. During parallel loading, serial data flow is inhibited. Clocking is accomplished on the low-to-high-level edge of the clock pulse through a two-input positive NOR gate permitting one input to be used as a clock-enable or clock-inhibit function. Holding either of the clock inputs high inhibits clocking; holding either low enables the other clock input. This, of course, allows the system clock to be free-running and the register can be stopped on command with the other clock input. The clock inhibit input should be changed to the high level only while the clock input is high. A buffered, direct clear input overrides all other inputs, including the clock, and sets all flip-flops to zero.
您可能感兴趣的相似米6体育平台手机版_好二三四
功能与比较器件相同,且具有相同引脚
技术文档
设计和开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
14-24-LOGIC-EVM — 采用 14 引脚至 24 引脚 D、DB、DGV、DW、DYY、NS 和 PW 封装的逻辑米6体育平台手机版_好二三四通用评估模块
14-24-LOGIC-EVM 评估模块 (EVM) 设计用于支持采用 14 引脚至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。
封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
PDIP (N) | 16 | Ultra Librarian |
SOIC (D) | 16 | Ultra Librarian |
SOP (NS) | 16 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点