米6体育平台手机版_好二三四详情

Technology family LV-A Supply voltage (min) (V) 2 Supply voltage (max) (V) 5.5 Number of channels 4 Inputs per channel 2 IOL (max) (mA) 12 IOH (max) (mA) -12 Input type Standard CMOS Output type Push-Pull Features Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Data rate (max) (Mbps) 70 Rating Catalog Operating temperature range (°C) -40 to 125
Technology family LV-A Supply voltage (min) (V) 2 Supply voltage (max) (V) 5.5 Number of channels 4 Inputs per channel 2 IOL (max) (mA) 12 IOH (max) (mA) -12 Input type Standard CMOS Output type Push-Pull Features Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Data rate (max) (Mbps) 70 Rating Catalog Operating temperature range (°C) -40 to 125
SOIC (D) 14 51.9 mm² 8.65 x 6 SOP (NS) 14 79.56 mm² 10.2 x 7.8 SSOP (DB) 14 48.36 mm² 6.2 x 7.8 TSSOP (PW) 14 32 mm² 5 x 6.4 TVSOP (DGV) 14 23.04 mm² 3.6 x 6.4 VQFN (RGY) 14 12.25 mm² 3.5 x 3.5
  • 2-V to 5.5-V VCC Operation
  • Max tpd of 6.5 ns at 5 V
  • Typical VOLP (Output Ground Bounce)
    < 0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot)
    > 2.3 V at VCC = 3.3 V, TA = 25°C
  • Support Mixed-Mode Voltage Operation on
    All Ports
  • Ioff Supports Live Insertion, Partial Power Down Mode, and Back Drive Protection
  • Latch-Up Performance Exceeds 250 mA
    Per JESD 17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model
    • 200-V Machine Model
    • 1000-V Charged-Device Model
  • 2-V to 5.5-V VCC Operation
  • Max tpd of 6.5 ns at 5 V
  • Typical VOLP (Output Ground Bounce)
    < 0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot)
    > 2.3 V at VCC = 3.3 V, TA = 25°C
  • Support Mixed-Mode Voltage Operation on
    All Ports
  • Ioff Supports Live Insertion, Partial Power Down Mode, and Back Drive Protection
  • Latch-Up Performance Exceeds 250 mA
    Per JESD 17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model
    • 200-V Machine Model
    • 1000-V Charged-Device Model

These quadruple 2-input positive-NAND gates are designed for 2-V to 5.5-V VCC operation.

The SNx4LV00A devices perform the boolean function Y = A ● B or Y = A + B in positive logic.

These quadruple 2-input positive-NAND gates are designed for 2-V to 5.5-V VCC operation.

The SNx4LV00A devices perform the boolean function Y = A ● B or Y = A + B in positive logic.

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功能与比较器件相同,且具有相同引脚
SN74LVC00A 正在供货 4 通道、双输入、1.65V 至 3.6V 与非门 Higher average drive strength (24mA)

技术文档

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类型 标题 下载最新的英语版本 日期
* 数据表 Quadruple 2-Input Positive-NAND Gates 数据表 (Rev. K) PDF | HTML 2015年 2月 27日
技术文章 It’s all in the family: a brief guide to logic family selection PDF | HTML 2015年 9月 10日

设计和开发

如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。

评估板

14-24-LOGIC-EVM — 采用 14 引脚至 24 引脚 D、DB、DGV、DW、DYY、NS 和 PW 封装的逻辑米6体育平台手机版_好二三四通用评估模块

14-24-LOGIC-EVM 评估模块 (EVM) 旨在支持采用 14 引脚至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。

用户指南: PDF | HTML
英语版 (Rev.B): PDF | HTML
TI.com 上无现货
评估板

14-24-NL-LOGIC-EVM — 采用 14 引脚至 24 引脚无引线封装的逻辑米6体育平台手机版_好二三四通用评估模块

14-24-EVM 是一款灵活的评估模块 (EVM),旨在支持具有 14 引脚至 24 引脚 BQA、BQB、RGY、RSV、RJW 或 RHL 封装的任何逻辑或转换器件。

用户指南: PDF | HTML
英语版 (Rev.A): PDF | HTML
TI.com 上无现货
仿真模型

HSPICE MODEL OF SN74LV00A

SCEJ208.ZIP (36 KB) - HSpice Model
仿真模型

SN74LV00A Behavioral SPICE Model

SCLM194.ZIP (7 KB) - PSpice Model
仿真模型

SN74LV00A IBIS Model

SCEM119.ZIP (16 KB) - IBIS Model
参考设计

PMP15035 — 1000W 双向 12V 至 12V 转换器参考设计

This reference design is a dual-channel, bidirectional converter suitable for 12-V to 12-V, dual-battery system, automotive applications. This reference design has a wide input range (3 V to 40 V) and could give full load (1kW) in the input voltage from 9V to 18V by using two LM5170-Q1 (...)
测试报告: PDF
原理图: PDF
封装 引脚 CAD 符号、封装和 3D 模型
SOIC (D) 14 Ultra Librarian
SOP (NS) 14 Ultra Librarian
SSOP (DB) 14 Ultra Librarian
TSSOP (PW) 14 Ultra Librarian
TVSOP (DGV) 14 Ultra Librarian
VQFN (RGY) 14 Ultra Librarian

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

支持和培训

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