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SN74LVT125-EP

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具有总线保持、TTL 兼容型 CMOS 输入和三态输出的 4 通道、2.7V 至 3.6V 缓冲器（增强型米6体育平台手机版_好二三四）

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SN74LVT125-EP

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米6体育平台手机版_好二三四详情

Technology family LVT Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 3.6 Number of channels 4 IOL (max) (mA) 32 Supply current (max) (µA) 7000 IOH (max) (mA) -32 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Bus-hold, Over-voltage tolerant inputs, Partial power down (Ioff), Ultra high speed (tpd <5ns) Rating HiRel Enhanced Product Operating temperature range (°C) -40 to 125
Technology family LVT Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 3.6 Number of channels 4 IOL (max) (mA) 32 Supply current (max) (µA) 7000 IOH (max) (mA) -32 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Bus-hold, Over-voltage tolerant inputs, Partial power down (Ioff), Ultra high speed (tpd <5ns) Rating HiRel Enhanced Product Operating temperature range (°C) -40 to 125
TSSOP (PW) 14 32 mm² 5 x 6.4
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of -40°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Supports Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
  • Supports Unregulated Battery Operation Down to 2.7 V
  • Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
  • Ioff Supports Partial-Power-Down Mode Operation
  • Bus-Hold Data Inputs Eliminate the Need for External Pullup Resistors

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of -40°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Supports Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
  • Supports Unregulated Battery Operation Down to 2.7 V
  • Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
  • Ioff Supports Partial-Power-Down Mode Operation
  • Bus-Hold Data Inputs Eliminate the Need for External Pullup Resistors

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

This bus buffer is designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

The SN74LVT125 features independent line drivers with 3-state outputs. Each output is in the high-impedance state when the associated output-enable (OE) input is high.

Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

This bus buffer is designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

The SN74LVT125 features independent line drivers with 3-state outputs. Each output is in the high-impedance state when the associated output-enable (OE) input is high.

Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
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类型 标题 下载最新的英语版本 日期
* 数据表 SN74LVT125-EP 数据表 (Rev. A) 2005年 5月 17日
* VID SN74LVT125-EP VID V6204705 2016年 6月 21日
* 辐射与可靠性报告 SN74LVT125QPWREP Reliability Report 2012年 5月 7日
应用手册 Implications of Slow or Floating CMOS Inputs (Rev. E) 2021年 7月 26日
选择指南 Logic Guide (Rev. AB) 2017年 6月 12日
应用手册 Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
选择指南 逻辑器件指南 2014 (Rev. AA) 最新英语版本 (Rev.AB) 2014年 11月 17日
选择指南 《高级总线接口逻辑器件选择指南》 英语版 2010年 7月 7日
用户指南 LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
应用手册 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
应用手册 TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
应用手册 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 2002年 5月 22日
应用手册 Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 2002年 5月 10日
应用手册 LVT-to-LVTH Conversion 1998年 12月 8日
应用手册 LVT Family Characteristics (Rev. A) 1998年 3月 1日
应用手册 Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997年 8月 1日
应用手册 Input and Output Characteristics of Digital Integrated Circuits 1996年 10月 1日
应用手册 Live Insertion 1996年 10月 1日
应用手册 Understanding Advanced Bus-Interface Products Design Guide 1996年 5月 1日

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封装 引脚 CAD 符号、封装和 3D 模型
TSSOP (PW) 14 Ultra Librarian
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包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

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