SN74LVT573

正在供货

具有三态输出的 3.3V ABT 八路透明 D 类锁存器

米6体育平台手机版_好二三四详情

Number of channels 8 Technology family LVT Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 3.6 Input type TTL-Compatible CMOS Output type 3-State Clock frequency (max) (MHz) 160 IOL (max) (mA) 16 IOH (max) (mA) -16 Supply current (max) (µA) 5000 Features High speed (tpd 10-50ns) Operating temperature range (°C) -40 to 85 Rating Catalog
Number of channels 8 Technology family LVT Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 3.6 Input type TTL-Compatible CMOS Output type 3-State Clock frequency (max) (MHz) 160 IOL (max) (mA) 16 IOH (max) (mA) -16 Supply current (max) (µA) 5000 Features High speed (tpd 10-50ns) Operating temperature range (°C) -40 to 85 Rating Catalog
SOIC (DW) 20 131.84 mm² 12.8 x 10.3 TSSOP (PW) 20 41.6 mm² 6.5 x 6.4
  • State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low Static Power Dissipation
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
  • Support Unregulated Battery Operation Down to 2.7 V
  • Typical VOLP (Output Ground Bounce)< 0.8 V at VCC = 3.3 V, TA = 25°C
  • ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
  • Bus-Hold Data Inputs Eliminate the Need for External Pullup Resistors
  • Support Live Insertion
  • Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Ceramic Flat (W) Packages, and Ceramic (J) DIPs
  • State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low Static Power Dissipation
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
  • Support Unregulated Battery Operation Down to 2.7 V
  • Typical VOLP (Output Ground Bounce)< 0.8 V at VCC = 3.3 V, TA = 25°C
  • ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
  • Bus-Hold Data Inputs Eliminate the Need for External Pullup Resistors
  • Support Live Insertion
  • Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Ceramic Flat (W) Packages, and Ceramic (J) DIPs

These octal latches are designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

The eight latches of the 'LVT573 are transparent D-type latches. While the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the logic levels set up at the D inputs.

A buffered output-enable input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components. does not affect the internal operations of the latches. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

To ensure the high-impedance state during power up or power down, should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74LVT573 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.

The SN54LVT573 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LVT573 is characterized for operation from -40°C to 85°C.

These octal latches are designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

The eight latches of the 'LVT573 are transparent D-type latches. While the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the logic levels set up at the D inputs.

A buffered output-enable input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components. does not affect the internal operations of the latches. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

To ensure the high-impedance state during power up or power down, should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74LVT573 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.

The SN54LVT573 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LVT573 is characterized for operation from -40°C to 85°C.

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类型 标题 下载最新的英语版本 日期
* 数据表 3.3-V ABT Octal Transparent D-Type Latches 数据表 (Rev. D) 1995年 7月 1日
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用户指南: PDF | HTML
英语版 (Rev.B): PDF | HTML
TI.com 上无现货
封装 引脚 CAD 符号、封装和 3D 模型
SOIC (DW) 20 Ultra Librarian
TSSOP (PW) 20 Ultra Librarian

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

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