TLV2460A

正在供货

具有关断功能的单通道、6V、6.4MHz、1.5mV 失调电压、RRIO 运算放大器

可提供此米6体育平台手机版_好二三四的更新版本

该米6体育平台手机版_好二三四会持续为现有客户提供。新设计应考虑替代米6体育平台手机版_好二三四。
功能优于所比较器件的普遍直接替代米6体育平台手机版_好二三四
TLV9061 正在供货 适用于成本优化型应用的单通道、5.5V、10MHz、RRIO 运算放大器 Higher GBW (10 MHz), faster slew rate (6.5 V/μs), lower power (0.538 mA)

米6体育平台手机版_好二三四详情

Number of channels 1 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 6 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 2.7 Rail-to-rail In, Out GBW (typ) (MHz) 6.4 Slew rate (typ) (V/µs) 1.6 Vos (offset voltage at 25°C) (max) (mV) 1.5 Iq per channel (typ) (mA) 0.55 Vn at 1 kHz (typ) (nV√Hz) 11 Rating Catalog Operating temperature range (°C) -40 to 125 Offset drift (typ) (µV/°C) 2 Features Shutdown Input bias current (max) (pA) 14000 CMRR (typ) (dB) 85 Iout (typ) (A) 0.08 Architecture Bipolar Input common mode headroom (to negative supply) (typ) (V) 0 Input common mode headroom (to positive supply) (typ) (V) 0 Output swing headroom (to negative supply) (typ) (V) 0.2 Output swing headroom (to positive supply) (typ) (V) -0.2
Number of channels 1 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 6 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 2.7 Rail-to-rail In, Out GBW (typ) (MHz) 6.4 Slew rate (typ) (V/µs) 1.6 Vos (offset voltage at 25°C) (max) (mV) 1.5 Iq per channel (typ) (mA) 0.55 Vn at 1 kHz (typ) (nV√Hz) 11 Rating Catalog Operating temperature range (°C) -40 to 125 Offset drift (typ) (µV/°C) 2 Features Shutdown Input bias current (max) (pA) 14000 CMRR (typ) (dB) 85 Iout (typ) (A) 0.08 Architecture Bipolar Input common mode headroom (to negative supply) (typ) (V) 0 Input common mode headroom (to positive supply) (typ) (V) 0 Output swing headroom (to negative supply) (typ) (V) 0.2 Output swing headroom (to positive supply) (typ) (V) -0.2
PDIP (P) 8 92.5083 mm² 9.81 x 9.43 SOIC (D) 8 29.4 mm² 4.9 x 6
  • Rail-to-Rail Output Swing
  • Gain Bandwidth Product...6.4 MHz
  • ±80 mA Output Drive Capability
  • Supply Current...500 µA/channel
  • Input Offset Voltage...100 µV
  • Input Noise Voltage...11 nV/Hz
  • Slew Rate...1.6 V/µs
  • Micropower Shutdown Mode (TLV2460/3/5)...0.3 µA/Channel
  • Universal Operational Amplifier EVM
  • Available in Q-Temp Automotive
       HighRel Automotive Applications
       Configuration Control/Print Support
       Qualification to Automotive Standards
  • Rail-to-Rail Output Swing
  • Gain Bandwidth Product...6.4 MHz
  • ±80 mA Output Drive Capability
  • Supply Current...500 µA/channel
  • Input Offset Voltage...100 µV
  • Input Noise Voltage...11 nV/Hz
  • Slew Rate...1.6 V/µs
  • Micropower Shutdown Mode (TLV2460/3/5)...0.3 µA/Channel
  • Universal Operational Amplifier EVM
  • Available in Q-Temp Automotive
       HighRel Automotive Applications
       Configuration Control/Print Support
       Qualification to Automotive Standards

The TLV246x is a family of low-power rail-to-rail input/output operational amplifiers specifically designed for portable applications. The input common-mode voltage range extends beyond the supply rails for maximum dynamic range in low-voltage systems. The amplifier output has rail-to-rail performance with high-output-drive capability, solving one of the limitations of older rail-to-rail input/output operational amplifiers. This rail-to-rail dynamic range and high output drive make the TLV246x ideal for buffering analog-to-digital converters.

The operational amplifier has 6.4 MHz of bandwidth and 1.6 V/µs of slew rate with only 500 µA of supply current, providing good ac performance with low power consumption. Three members of the family offer a shutdown terminal, which places the amplifier in an ultralow supply current mode (IDD = 0.3 µA/ch). While in shutdown, the operational-amplifier output is placed in a high-impedance state. DC applications are also well served with an input noise voltage of 11 nV/Hz and input offset voltage of 100 µV.

This family is available in the low-profile SOT23, MSOP, and TSSOP packages. The TLV2460 is the first rail-to-rail input/output operational amplifier with shutdown available in the 6-pin SOT23, making it perfect for high-density circuits. The family is specified over an expanded temperature range (TA = –40°C to 125°C) for use in industrial control and automotive systems, and over the military temperature range (TA = –55°C to 125°C) for use in military systems.

The TLV246x is a family of low-power rail-to-rail input/output operational amplifiers specifically designed for portable applications. The input common-mode voltage range extends beyond the supply rails for maximum dynamic range in low-voltage systems. The amplifier output has rail-to-rail performance with high-output-drive capability, solving one of the limitations of older rail-to-rail input/output operational amplifiers. This rail-to-rail dynamic range and high output drive make the TLV246x ideal for buffering analog-to-digital converters.

The operational amplifier has 6.4 MHz of bandwidth and 1.6 V/µs of slew rate with only 500 µA of supply current, providing good ac performance with low power consumption. Three members of the family offer a shutdown terminal, which places the amplifier in an ultralow supply current mode (IDD = 0.3 µA/ch). While in shutdown, the operational-amplifier output is placed in a high-impedance state. DC applications are also well served with an input noise voltage of 11 nV/Hz and input offset voltage of 100 µV.

This family is available in the low-profile SOT23, MSOP, and TSSOP packages. The TLV2460 is the first rail-to-rail input/output operational amplifier with shutdown available in the 6-pin SOT23, making it perfect for high-density circuits. The family is specified over an expanded temperature range (TA = –40°C to 125°C) for use in industrial control and automotive systems, and over the military temperature range (TA = –55°C to 125°C) for use in military systems.

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类型 标题 下载最新的英语版本 日期
* 数据表 Rail-to-Rail Input/Output Operational Amplifiers w/ Shutdown 数据表 (Rev. J) 2004年 2月 29日

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

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