TPS65175B
- 8.6V to 14.7V Input Voltage Range
- Boost Converter VDD: 12.7V…19V (6-Bit)
- Integrated Input-to-Output Isolation Switch
- Buck Converter HVDD: VDD Tracking
- Buck Converter VCC: 1.6V...2.0V & 3.0V…3.6V (4-Bit)
- Positive Charge Pump VGH:
- 19V…34V for Low Temperature (4-Bit)
- 17V…32V for High Temperature (4-Bit)
- Negative Charge Pump VGL: –1.8V…–8.1V (6-Bit)
- 6-Ch Gamma Buffer:
- 3-Ch: VDD…HVDD (9-Bit)
- 3-Ch: HVDD...GND (9-Bit)
- 9-Bit VCOM Reference
- 3-Bit VCOM Gain
- VCOM_DAC Output for External Operational Amplifier Reference
- Temperature Compensation for VGH and VCOM
- Reset Signal with Programmable Delay Time
- Programmable Sequencing Delays (4 × 3-Bit)
- Thermal Shutdown
- 12-Channel Level Shifters:
- Supports Forward and Reverse Operation
- Abnormal Operation Detection
- 56-Pin 7-mm × 7-mm QFN Package
The TPS65175B/C provides a simple and economic power supply solution for a wide variety of LCD bias applications. The device provides all supply rails needed by a TFT-LCD panel but also 6 gamma references, a supply rail for LVDS support, as well as a Vcom reference. The device also integrates a VCOM_DAC rail providing the reference for an external non-inverting operational amplifier input. A 12-Channel Level Shifter is also integrated. The solution is delivered in a small 7×7 mm QFN package.
The TPS65175B/C provides a simple and economic power supply solution for a wide variety of LCD bias applications. The device provides all supply rails needed by a TFT-LCD panel. VCC and RST for the T-Con. VDD and HVDD for the Source Driver. VGH and VGL for the Gate Driver or the Level Shifters. A VCOM operational amplifier is also integrated to provide a common plane reference. The VGH and VCOM / VCOM_DAC voltages can be compensated for low and high temperatures. The transition from one programmed value to another is made using an external thermistor connected to the IC. In addition, a 6-channel Gamma Buffer as well as a 12-Channel Level Shifter are integrated. All output rails and delay times are programmable by a two-wire interface: a single BOM (Bill of Material) can cover several panel types and sizes whose desired output levels can be programmed in production and stored in a non-volatile memory embedded into the TPS65175B/C. The solution is delivered in a small 7 mm × 7 mm QFN-56 package.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | TPS65175B/C 1 page email address 数据表 | 2013年 7月 24日 | |||
应用手册 | Basic Calculation of a Boost Converter's Power Stage... (Rev. D) | PDF | HTML | 2022年 11月 21日 | |||
应用手册 | 升压转换器功率级的基本计算 (Rev. D) | PDF | HTML | 英语版 (Rev.D) | PDF | HTML | 2022年 11月 11日 | |
应用手册 | Understanding Undervoltage Lockout in Power Devices (Rev. A) | 2018年 9月 19日 | ||||
应用手册 | Basic Calculation of a Buck Converter's Power Stage (Rev. B) | 2015年 8月 17日 |
设计和开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
PSPICE-FOR-TI — 适用于 TI 设计和模拟工具的 PSpice®
借助 PSpice for TI 的设计和仿真环境及其内置的模型库,您可对复杂的混合信号设计进行仿真。创建完整的终端设备设计和原型解决方案,然后再进行布局和制造,可缩短米6体育平台手机版_好二三四上市时间并降低开发成本。
在 PSpice for TI 设计和仿真工具中,您可以搜索 TI (...)
封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
VQFN (RSH) | 56 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点