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TSU5511

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具有阻抗检测微型 USB 开关的 SP3T 开关

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数据表

TSU5511

已停产
数据表 立即订购

米6体育平台手机版_好二三四详情

Type Passive mux Function USB 2.0 USB speed (Mbps) 480 Number of channels 2 Supply voltage (max) (V) 6.7 Supply voltage (min) (V) 2.8 Ron (typ) (mΩ) 4500 Input/output voltage (min) (V) -1.3 Input/output voltage (max) (V) 3.6 Configuration 3:1 Features Audio Switch (Negative Rail Capability), Charging Capability, Click-Pop Reduction, I2C interface, Impedance Detection, UART, USB 2.0 Rating Catalog Operating temperature range (°C) -40 to 85 Supply current (max) (µA) 70 ESD HBM (typ) (kV) 2 Bandwidth (MHz) 830
Type Passive mux Function USB 2.0 USB speed (Mbps) 480 Number of channels 2 Supply voltage (max) (V) 6.7 Supply voltage (min) (V) 2.8 Ron (typ) (mΩ) 4500 Input/output voltage (min) (V) -1.3 Input/output voltage (max) (V) 3.6 Configuration 3:1 Features Audio Switch (Negative Rail Capability), Charging Capability, Click-Pop Reduction, I2C interface, Impedance Detection, UART, USB 2.0 Rating Catalog Operating temperature range (°C) -40 to 85 Supply current (max) (µA) 70 ESD HBM (typ) (kV) 2 Bandwidth (MHz) 830
DSBGA (YZP) 20 6.1875 mm² 2.25 x 2.75
  • Compatible Accessories
    • USB Data Cable
    • UART Cable
    • Charger (Dedicated Charger or Host/Hub Charger)
    • Stereo Headset With Mic
  • Integrated LDOs for VREF and Mic Bias
  • USB Path Supports USB 2.0 High Speed
  • Audio Path Provides Negative Rail Support and Click/Pop Reduction
  • Supports Factory Test Mode
  • 1.8-V Compatible I2C Interface
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • ESD Performance DP/DM/ID/VBUS to GND
    • ±8-kV Contact Discharge (IEC 61000-4-2)
    • ±15-kV Air Gap Discharge (IEC 61000-4-2)
  • APPLICATIONS
    • Cellular Telephones
  • Compatible Accessories
    • USB Data Cable
    • UART Cable
    • Charger (Dedicated Charger or Host/Hub Charger)
    • Stereo Headset With Mic
  • Integrated LDOs for VREF and Mic Bias
  • USB Path Supports USB 2.0 High Speed
  • Audio Path Provides Negative Rail Support and Click/Pop Reduction
  • Supports Factory Test Mode
  • 1.8-V Compatible I2C Interface
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • ESD Performance DP/DM/ID/VBUS to GND
    • ±8-kV Contact Discharge (IEC 61000-4-2)
    • ±15-kV Air Gap Discharge (IEC 61000-4-2)
  • APPLICATIONS
    • Cellular Telephones

The TSU5511 is designed to interface the cell phone UART, USB, and audio chips with external peripherals via a micro-USB connector. The switch features impedance detection for identification of various accessories that are attached through DP and DM of the micro-USB port. When an accessory is plugged into the micro-USB port, the switch uses a detection mechanism to identify the accessory (see State Machine for details). It will then switch to the appropriate channel—data, audio, or UART.

The TSU5511 has an I2C interface for communication with the cellphone baseband or applications processor. An interrupt is generated when anything plugged into the micro-USB is detected. Another interrupt is generated when the device is unplugged.

The TSU5511 is designed to interface the cell phone UART, USB, and audio chips with external peripherals via a micro-USB connector. The switch features impedance detection for identification of various accessories that are attached through DP and DM of the micro-USB port. When an accessory is plugged into the micro-USB port, the switch uses a detection mechanism to identify the accessory (see State Machine for details). It will then switch to the appropriate channel—data, audio, or UART.

The TSU5511 has an I2C interface for communication with the cellphone baseband or applications processor. An interrupt is generated when anything plugged into the micro-USB is detected. Another interrupt is generated when the device is unplugged.
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类型 标题 下载最新的英语版本 日期
* 数据表 SP3T SWITCH WITH IMPEDANCE DETECTION 数据表 2010年 9月 2日

订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点