XTR101
- INSTRUMENTATION AMPLIFIER INPUT:
- Low Offset Voltage, 30µV max
- Low Voltage Drift, 0.75µV/°C max
- Low Nonlinearity, 0.01% max
- TRUE TWO-WIRE OPERATION:
- Power and Signal on One Wire Pair
- Current Mode Signal Transmission
- High Noise Immunity
- DUAL MATCHED CURRENT SOURCES
- WIDE SUPPLY RANGE: 11.6V to 40V
- SPECIFICATION RANGE: –40°C to +85°C
- SMALL DIP-14 PACKAGE, CERAMIC AND PLASTIC
- APPLICATIONS
- INDUSTRIAL PROCESS CONTROL:
- Pressure Transmitters
- Temperature Transmitters
- Millivolt Transmitters
- RESISTANCE BRIDGE INPUTS
- THERMOCOUPLE INPUTS
- RTD INPUTS
- CURRENT SHUNT (mV) INPUTS
- PRECISION DUAL CURRENT SOURCES
- AUTOMATED MANUFACTURING
- POWER/PLANT ENERGY SYSTEM MONITORING
- INDUSTRIAL PROCESS CONTROL:
All trademarks are the property of their respective owners.
The XTR101 is a microcircuit, 4-20mA, two-wire transmitter containing a high accuracy instrumentation amplifier (IA), a voltage-controlled output current source, and dual-matched precision current reference. This combination is ideally suited for remote signal conditioning of a wide variety of transducers such as thermocouples, RTDs, thermistors, and strain gauge bridges. State-of-the-art design and laser-trimming, wide temperature range operation, and small size make it very suitable for industrial process control applications. In addition, the optional external transistor allows even higher precision.
The two-wire transmitter allows signal and power to be supplied on a single wire pair by modulating the power-supply current with the input signal source. The transmitter is immune to voltage drops from long runs and noise from motors, relays, actuators, switches, transformers, and industrial equipment. It can be used by OEMs producing transmitter modules or by data acquisition system manufacturers.
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功能与比较器件相同,且具有相同引脚
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | XTR101: Precision, Low Drift 4-20mA Two-Wire Transmitter 数据表 (Rev. A) | 2004年 8月 3日 |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点