SNAS838A
October 2022 – November 2022
LMK04832-SEP
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Timing Requirements
6.7
Timing Diagram
6.8
Typical Characteristics
7
Parameter Measurement Information
7.1
Charge Pump Current Specification Definitions
7.1.1
Charge Pump Output Current Magnitude Variation vs Charge Pump Output Voltage
7.1.2
Charge Pump Sink Current vs Charge Pump Output Source Current Mismatch
7.1.3
Charge Pump Output Current Magnitude Variation vs Ambient Temperature
7.2
Differential Voltage Measurement Terminology
8
Detailed Description
8.1
Overview
8.1.1
Differences from the LMK04832
8.1.1.1
Jitter Cleaning
8.1.1.2
JEDEC JESD204B/C Support
8.1.2
Clock Inputs
8.1.2.1
Inputs for PLL1
8.1.2.2
Inputs for PLL2
8.1.2.3
Inputs When Using Clock Distribution Mode
8.1.3
PLL1
8.1.3.1
Frequency Holdover
8.1.3.2
External VCXO for PLL1
8.1.4
PLL2
8.1.4.1
Internal VCOs for PLL2
8.1.4.2
External VCO Mode
8.1.5
Clock Distribution
8.1.5.1
Clock Divider
8.1.5.2
High Performance Divider Bypass Mode
8.1.5.3
SYSREF Clock Divider
8.1.5.4
Device Clock Delay
8.1.5.5
Dynamic Digital Delay
8.1.5.6
SYSREF Delay: Global and Local
8.1.5.7
Programmable Output Formats
8.1.5.8
Clock Output Synchronization
8.1.6
0-Delay
8.1.7
Status Pins
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Synchronizing PLL R Dividers
8.3.1.1
PLL1 R Divider Synchronization
8.3.1.2
PLL2 R Divider Synchronization
8.3.2
SYNC/SYSREF
8.3.3
JEDEC JESD204B/C
8.3.3.1
How to Enable SYSREF
8.3.3.1.1
Setup of SYSREF Example
8.3.3.1.2
SYSREF_CLR
8.3.3.2
SYSREF Modes
8.3.3.2.1
SYSREF Pulser
8.3.3.2.2
Continuous SYSREF
8.3.3.2.3
SYSREF Request
8.3.4
Digital Delay
8.3.4.1
Fixed Digital Delay
8.3.4.1.1
Fixed Digital Delay Example
8.3.4.2
Dynamic Digital Delay
8.3.4.3
Single and Multiple Dynamic Digital Delay Example
8.3.5
SYSREF to Device Clock Alignment
8.3.6
Input Clock Switching
8.3.6.1
Input Clock Switching - Manual Mode
8.3.6.2
Input Clock Switching - Pin Select Mode
8.3.6.3
Input Clock Switching - Automatic Mode
8.3.7
Digital Lock Detect (DLD)
8.3.7.1
Calculating Digital Lock Detect Frequency Accuracy
8.3.8
Holdover
8.3.8.1
Enable Holdover
8.3.8.1.1
Fixed (Manual) CPout1 Holdover Mode
8.3.8.1.2
Tracked CPout1 Holdover Mode
8.3.8.2
During Holdover
8.3.8.3
Exiting Holdover
8.3.8.4
Holdover Frequency Accuracy and DAC Performance
8.3.9
PLL2 Loop Filter
8.4
Device Functional Modes
8.4.1
DUAL PLL
8.4.1.1
Dual Loop
8.4.1.2
Dual Loop With Cascaded 0-Delay
8.4.1.3
Dual Loop With Nested 0-Delay
8.4.2
Single PLL
8.4.2.1
PLL2 Single Loop
8.4.2.2
PLL2 With External VCO
8.4.3
Distribution Mode
8.5
Programming
8.5.1
Recommended Programming Sequence
8.6
Register Maps
8.6.1
Register Map for Device Programming
8.6.2
Device Register Descriptions
8.6.2.1
System Functions
8.6.2.1.1
RESET, SPI_3WIRE_DIS
8.6.2.1.2
POWERDOWN
8.6.2.1.3
ID_DEVICE_TYPE
8.6.2.1.4
ID_PROD
8.6.2.1.5
ID_MASKREV
8.6.2.1.6
ID_VNDR
8.6.2.2
(0x100 - 0x138) Device Clock and SYSREF Clock Output Controls
8.6.2.2.1
DCLKX_Y_DIV
8.6.2.2.2
DCLKX_Y_DDLY
8.6.2.2.3
CLKoutX_Y_PD, CLKoutX_Y_ODL, CLKoutX_Y_IDL, DCLKX_Y_DDLY_PD, DCLKX_Y_DDLY[9:8], DCLKX_Y_DIV[9:8]
8.6.2.2.4
CLKoutX_SRC_MUX, DCLKX_Y_PD, DCLKX_Y_BYP, DCLKX_Y_DCC, DCLKX_Y_POL, DCLKX_Y_HS
8.6.2.2.5
CLKoutY_SRC_MUX, SCLKX_Y_PD, SCLKX_Y_DIS_MODE, SCLKX_Y_POL, SCLKX_Y_HS
8.6.2.2.6
SCLKX_Y_ADLY_EN, SCLKX_Y_ADLY
8.6.2.2.7
SCLKX_Y_DDLY
8.6.2.2.8
CLKoutY_FMT, CLKoutX_FMT
8.6.2.3
SYSREF, SYNC, and Device Config
8.6.2.3.1
VCO_MUX, OSCout_MUX, OSCout_FMT
8.6.2.3.2
SYSREF_REQ_EN, SYNC_BYPASS, SYSREF_MUX
8.6.2.3.3
SYSREF_DIV
8.6.2.3.4
SYSREF_DDLY
8.6.2.3.5
SYSREF_PULSE_CNT
8.6.2.3.6
PLL2_RCLK_MUX, PLL2_NCLK_MUX, PLL1_NCLK_MUX, FB_MUX, FB_MUX_EN
8.6.2.3.7
PLL1_PD, VCO_LDO_PD, VCO_PD, OSCin_PD, SYSREF_GBL_PD, SYSREF_PD, SYSREF_DDLY_PD, SYSREF_PLSR_PD
8.6.2.3.8
DDLYdSYSREF_EN, DDLYdX_EN
8.6.2.3.9
DDLYd_STEP_CNT
8.6.2.3.10
SYSREF_CLR, SYNC_1SHOT_EN, SYNC_POL, SYNC_EN, SYNC_PLL2_DLD, SYNC_PLL1_DLD, SYNC_MODE
8.6.2.3.11
SYNC_DISSYSREF, SYNC_DISX
8.6.2.3.12
PLL1R_SYNC_EN, PLL1R_SYNC_SRC, PLL2R_SYNC_EN, FIN0_DIV2_EN, FIN0_INPUT_TYPE
8.6.2.4
(0x146 - 0x149) CLKIN Control
8.6.2.4.1
CLKin_SEL_PIN_EN, CLKin_SEL_PIN_POL, CLKin2_EN, CLKin1_EN, CLKin0_EN, CLKin2_TYPE, CLKin1_TYPE, CLKin0_TYPE
8.6.2.4.2
CLKin_SEL_AUTO_REVERT_EN, CLKin_SEL_AUTO_EN, CLKin_SEL_MANUAL, CLKin1_DEMUX, CLKin0_DEMUX
8.6.2.4.3
CLKin_SEL0_MUX, CLKin_SEL0_TYPE
8.6.2.4.4
SDIO_RDBK_TYPE, CLKin_SEL1_MUX, CLKin_SEL1_TYPE
8.6.2.5
RESET_MUX, RESET_TYPE
8.6.2.6
(0x14B - 0x152) Holdover
8.6.2.6.1
LOS_TIMEOUT, LOS_EN, TRACK_EN, HOLDOVER_FORCE, MAN_DAC_EN, MAN_DAC[9:8]
8.6.2.6.2
MAN_DAC
8.6.2.6.3
DAC_TRIP_LOW
8.6.2.6.4
DAC_CLK_MULT, DAC_TRIP_HIGH
8.6.2.6.5
DAC_CLK_CNTR
8.6.2.6.6
CLKin_OVERRIDE, HOLDOVER_EXIT_MODE, HOLDOVER_PLL1_DET, LOS_EXTERNAL_INPUT, HOLDOVER_VTUNE_DET, CLKin_SWITCH_CP_TRI, HOLDOVER_EN
8.6.2.6.7
HOLDOVER_DLD_CNT
8.6.2.7
(0x153 - 0x15F) PLL1 Configuration
8.6.2.7.1
CLKin0_R
8.6.2.7.2
CLKin1_R
8.6.2.7.3
CLKin2_R
8.6.2.7.4
PLL1_N
8.6.2.7.5
PLL1_WND_SIZE, PLL1_CP_TRI, PLL1_CP_POL, PLL1_CP_GAIN
8.6.2.7.6
PLL1_DLD_CNT
8.6.2.7.7
HOLDOVER_EXIT_NADJ
8.6.2.7.8
PLL1_LD_MUX, PLL1_LD_TYPE
8.6.2.8
(0x160 - 0x16E) PLL2 Configuration
8.6.2.8.1
PLL2_R
8.6.2.8.2
PLL2_P, OSCin_FREQ, PLL2_REF_2X_EN
8.6.2.8.3
PLL2_N_CAL
8.6.2.8.4
PLL2_N
8.6.2.8.5
PLL2_WND_SIZE, PLL2_CP_GAIN, PLL2_CP_POL, PLL2_CP_TRI
8.6.2.8.6
PLL2_DLD_CNT
8.6.2.8.7
PLL2_LD_MUX, PLL2_LD_TYPE
8.6.2.9
(0x16F - 0x555) Misc Registers
8.6.2.9.1
PLL2_PRE_PD, PLL2_PD, FIN0_PD
8.6.2.9.2
PLL1R_RST
8.6.2.9.3
CLR_PLL1_LD_LOST, CLR_PLL2_LD_LOST
8.6.2.9.4
RB_PLL1_LD_LOST, RB_PLL1_LD, RB_PLL2_LD_LOST, RB_PLL2_LD
8.6.2.9.5
RB_DAC_VALUE (MSB), RB_CLKinX_SEL, RB_CLKinX_LOS
8.6.2.9.6
RB_DAC_VALUE
8.6.2.9.7
RB_HOLDOVER
8.6.2.9.8
SPI_LOCK
9
Application and Implementation
9.1
Application Information
9.1.1
Treatment of Unused Pins
9.1.2
Frequency Planning and Spur Minimization
9.1.3
Digital Lock Detect Frequency Accuracy
9.1.3.1
Minimum Lock Time Calculation Example
9.1.4
Driving CLKIN AND OSCIN Inputs
9.1.4.1
Driving CLKIN and OSCIN PINS With a Differential Source
9.1.4.2
Driving CLKIN Pins With a Single-Ended Source
9.1.5
OSCin Doubler for Best Phase Noise Performance
9.1.6
Radiation Environments
9.1.6.1
Total Ionizing Dose
9.1.6.2
Single Event Effect
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
Device Selection
9.2.2.1.1
Clock Architect
9.2.2.2
Device Configuration and Simulation
9.2.2.3
Device Setup
9.2.3
Application Curve
9.3
Power Supply Recommendations
9.3.1
Current Consumption
9.3.2
Cold Sparing Considerations
9.3.2.1
Damage Prevention Details to Unpowered Device
9.4
Layout
9.4.1
Layout Guidelines
9.4.2
Layout Example
9.4.3
Thermal Management
10
Device and Documentation Support
10.1
Device Support
10.1.1
Development Support
10.1.1.1
Clock Architect
10.1.1.2
PLLatinum Simulation
10.1.1.3
TICS Pro
10.2
Documentation Support
10.2.1
Related Documentation
10.3
Receiving Notification of Documentation Updates
10.4
Support Resources
10.5
Trademarks
10.6
Electrostatic Discharge Caution
10.7
Glossary
11
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
PAP|64
MPQF071C
Thermal pad, mechanical data (Package|Pins)
PAP|64
PPTD060M
Orderable Information
snas838a_oa
snas838a_pm
1
Features
VID#: V62/22612
Total ionizing dose 30 krad (ELDRS-free)
SEL immune >43 MeV × cm
2
/mg
SEFI immune >43 MeV × cm
2
/mg
Ambient temperature range: –55°C to 125°C
Maximum clock output frequency: 3255 MHz
Multi-mode: dual PLL, single PLL, and clock distribution
6-GHz external VCO or distribution input
Ultra-low noise, at 2500 MHz:
54-fs RMS jitter (12 kHz to 20 MHz)
64-fs RMS jitter (100 Hz to 20 MHz)
–157.6-dBc/Hz noise floor
Ultra-low noise, at 3200 MHz:
61-fs RMS jitter (12 kHz to 20 MHz)
67-fs RMS jitter (100 Hz to 100 MHz)
–156.5-dBc/Hz noise floor
PLL2
PLL FOM of –230 dBc/Hz
PLL 1/f of –128 dBc/Hz
Phase detector rate up to 320 MHz
Two integrated VCOs: 2440 to 2600 MHz
and 2945 to 3255 MHz
Up to 14 differential device clocks
CML, LVPECL, LCPECL, HSDS, LVDS, and 2xLVCMOS programmable outputs
Up to 1 buffered VCXO/XO output
LVPECL, LVDS, 2xLVCMOS programmable
1-1023 CLKOUT divider
1-8191 SYSREF divider
25-ps step analog delay for SYSREF clocks
Digital delay and dynamic digital delay for device clocks and SYSREF
Holdover mode with PLL1
0-delay with PLL1 or PLL2
High Reliability
Controlled Baseline
One Assembly/Test Site
One Fabrication Site
Extended Product Life Cycle
Extended Product-Change Notification
Product Traceability
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