SCPS268A September   2017  – February 2022 TIC10024-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  VS Pin
      2. 8.3.2  VDD Pin
      3. 8.3.3  Device Initialization
      4. 8.3.4  Device Trigger
      5. 8.3.5  Device Reset
        1. 8.3.5.1 VS Supply POR
        2. 8.3.5.2 Hardware Reset
        3. 8.3.5.3 Software Reset
      6. 8.3.6  VS Under-Voltage (UV) Condition
      7. 8.3.7  VS Over-Voltage (OV) Condition
      8. 8.3.8  Switch Inputs Settings
        1. 8.3.8.1 Input Current Source and Sink Selection
        2. 8.3.8.2 Input Enable Selection
        3. 8.3.8.3 Thresholds Adjustment
        4. 8.3.8.4 Wetting Current Configuration
      9. 8.3.9  Interrupt Generation and INT Assertion
        1. 8.3.9.1 INT Pin Assertion Scheme
        2. 8.3.9.2 Interrupt Idle Time (tINT_IDLE) Time
        3. 8.3.9.3 Microcontroller Wake-Up
        4. 8.3.9.4 Interrupt Enable / Disable And Interrupt Generation Conditions
        5. 8.3.9.5 Detection Filter
      10. 8.3.10 Temperature Monitor
        1. 8.3.10.1 Temperature Warning (TW)
        2. 8.3.10.2 Temperature Shutdown (TSD)
      11. 8.3.11 Parity Check And Parity Generation
      12. 8.3.12 Cyclic Redundancy Check (CRC)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Continuous Mode
      2. 8.4.2 Polling Mode
      3. 8.4.3 Additional Features
        1. 8.4.3.1 Clean Current Polling (CCP)
        2. 8.4.3.2 Wetting Current Auto-Scaling
  9. 9 Programming
    1. 9.1 SPI Communication Interface Buses
      1. 9.1.1 Chip Select ( CS)
      2. 9.1.2 System Clock (SCLK)
      3. 9.1.3 Slave In (SI)
      4. 9.1.4 Slave Out (SO)
    2. 9.2 SPI Sequence
      1. 9.2.1 Read Operation
      2. 9.2.2 Write Operation
      3. 9.2.3 Status Flag
    3. 9.3 Programming Guidelines
    4. 9.4 Register Maps
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Digital Switch Detection in Automotive Body Control Module
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
    3. 10.3 Systems Examples
      1. 10.3.1 Using TIC10024-Q1 in a 12 V Automotive System
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Community Resources
    3. 13.3 Trademarks
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Qualified for automotive applications
  • AEC-Q100 Qualified with the following results:
    • Device temperature grade 1: –40°C to 125°C ambient operating temperature
    • Device HBM ESD classification level H2
    • Device CDM ESD classification level C4B
  • Functional Safety-Capable
  • Designed to support 12-V automotive systems with over-voltage and under-voltage warning
  • Monitors up to 24 direct switch inputs with 10 inputs configurable to monitor switches connected to either ground or battery
  • Switch input withstands up to 40 V (load dump condition) and down to –24 V (reverse polarity condition)
  • 6 Configurable wetting current settings:
    (0 mA, 1 mA, 2 mA, 5 mA, 10 mA, and 15 mA)
  • Integrated comparator with 4 programmable thresholds for digital switch monitoring
  • Ultra-low operating current in polling mode:
    68 μA typical (tPOLL = 64 ms, tPOLL_ACT = 128 μs,
    all 24 inputs active, comparator mode, all switches open)
  • Interfaces directly to MCU using 3.3 V / 5 V serial peripheral interface (SPI) protocol
  • Interrupt generation to support wake-up operation on all inputs
  • ±8 kV Contact discharge ESD protection on input pins per ISO-10605 with appropriate external components
  • 38-Pin TSSOP package
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