SCPS260C
August 2017 – February 2022
TIC12400-Q1
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Timing Requirements
6.7
Typical Characteristics
7
Parameter Measurement Information
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
VS Pin
8.3.2
VDD Pin
8.3.3
Device Initialization
8.3.4
Device Trigger
8.3.5
Device Reset
8.3.5.1
VS Supply POR
8.3.5.2
Hardware Reset
8.3.5.3
Software Reset
8.3.6
VS Under-Voltage (UV) Condition
8.3.7
VS Over-Voltage (OV) Condition
8.3.8
Switch Inputs Settings
8.3.8.1
Input Current Source and Sink Selection
8.3.8.2
Input Mode Selection
8.3.8.3
Input Enable Selection
8.3.8.4
Thresholds Adjustment
8.3.8.5
Wetting Current Configuration
8.3.9
Interrupt Generation and INT Assertion
8.3.9.1
INT Pin Assertion Scheme
8.3.9.2
Interrupt Idle Time (tINT_IDLE) Time
8.3.9.3
Microcontroller Wake-Up
8.3.9.4
Interrupt Enable or Disable and Interrupt Generation Conditions
8.3.9.5
Detection Filter
8.3.10
Temperature Monitor
8.3.10.1
Temperature Warning (TW)
8.3.10.2
Temperature Shutdown (TSD)
8.3.11
Parity Check and Parity Generation
8.3.12
Cyclic Redundancy Check (CRC)
8.4
Device Functional Modes
8.4.1
Continuous Mode
8.4.2
Polling Mode
8.4.2.1
Standard Polling
8.4.2.2
Matrix polling
8.4.3
Additional Features
8.4.3.1
Clean Current Polling (CCP)
8.4.3.2
Wetting Current Auto-Scaling
8.4.3.3
VS Measurement
8.4.3.4
Wetting Current Diagnostic
8.4.3.5
ADC Self-Diagnostic
8.5
Programming
8.5.1
SPI Communication Interface Buses
8.5.1.1
Chip Select ( CS)
8.5.1.2
System Clock (SCLK)
8.5.1.3
Slave In (SI)
8.5.1.4
Slave Out (SO)
8.5.2
SPI Sequence
8.5.2.1
Read Operation
8.5.2.2
Write Operation
8.5.2.3
Status Flag
8.6
Register Maps
8.7
Programming Guidelines
9
Application Information Disclaimer
9.1
Application Information
9.2
Using TIC12400-Q1 in a 12 V Automotive System
9.3
Resistor-coded Switches Detection in Automotive Body Control Module
9.3.1
Design Requirements
9.3.2
Detailed Design Procedure
9.3.3
Application Curves
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Receiving Notification of Documentation Updates
12.2
Support Resources
12.3
Trademarks
12.4
Electrostatic Discharge Caution
12.5
Glossary
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DCP|38
MPDS520B
Thermal pad, mechanical data (Package|Pins)
DCP|38
PPTD170A
Orderable Information
scps260c_oa
scps260c_pm
1
Features
Qualified for automotive applications
AEC-Q100 qualified with the following results:
Device temperature grade 1: –40°C to 125°C ambient operating temperature
Device HBM ESD classification level H2
Device CDM ESD classification level C4B
Functional Safety-Capable
Documentation available to aid functional safety system design
Designed to support 12 V automotive systems with over-voltage and under-voltage warning
Monitors up to 24 direct switch inputs with 10 inputs configurable to monitor switches connected to either ground or battery
Switch input withstands up to 40 V (load dump condition) and down to −24 V (reverse polarity condition)
6 configurable wetting current settings:
(0 mA, 1 mA, 2 mA, 5 mA, 10 mA, and 15 mA)
Integrated 10-bit ADC for multi-position analog switch monitoring
Integrated comparator with 4 programmable thresholds for digital switch monitoring
Ultra-low operating current in polling mode:
68 μA typical (t
POLL
= 64 ms, t
POLL_ACT
= 128 μs,
all 24 inputs active, comparator mode, all switches open)
Interfaces directly to MCU using 3.3 V / 5 V serial peripheral interface (SPI) protocol
Interrupt generation to support wake-up operation on all inputs
Integrated battery and temperature sensing
±8 kV contact discharge ESD protection on input pins per ISO-10605 with appropriate external components
38-Pin TSSOP package
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