ZHCSMR7C November   2020  – July 2022 AWR6843AOP

PRODUCTION DATA  

1. 1 特性
2. 2 应用
3. 3 说明
4. 4 功能方框图
5. 5 Revision History
6. 6 Device Comparison
   1. 6.1 Related Products
7. 7 Terminal Configuration and Functions
   1. 7.1 Pin Diagram
   2. 7.2 Signal Descriptions
      1. 7.2.1 Pin Functions - Digital and Analog [ALP Package]
   3. 7.3 Pin Attributes
8. 8 Specifications
   1. 8.1  Absolute Maximum Ratings
   2. 8.2  ESD Ratings
   3. 8.3  Power-On Hours (POH)
   4. 8.4  Recommended Operating Conditions
   5. 8.5  Power Supply Specifications
   6. 8.6  Power Consumption Summary
   7. 8.7  RF Specification
   8. 8.8  CPU Specifications
   9. 8.9  Thermal Resistance Characteristics for FCBGA Package [ALP0180A]
   10. 8.10 Timing and Switching Characteristics
       1. 8.10.1  Antenna Radiation Patterns
          1. 8.10.1.1 Antenna Radiation Patterns for Receiver
          2. 8.10.1.2 Antenna Radiation Patterns for Transmitter
       2. 8.10.2  Antenna Positions
       3. 8.10.3  Power Supply Sequencing and Reset Timing
       4. 8.10.4  Input Clocks and Oscillators
          1. 8.10.4.1 Clock Specifications
       5. 8.10.5  Multibuffered / Standard Serial Peripheral Interface (MibSPI)
          1. 8.10.5.1 Peripheral Description
          2. 8.10.5.2 MibSPI Transmit and Receive RAM Organization
             1. 8.10.5.2.1 SPI Timing Conditions
             2. 8.10.5.2.2 SPI Controller Mode Switching Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input)
             3. 8.10.5.2.3 SPI Controller Mode Switching Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input)
          3. 8.10.5.3 SPI Peripheral Mode I/O Timings
             1. 8.10.5.3.1 SPI Peripheral Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output) (1) (1) (1)
          4. 8.10.5.4 Typical Interface Protocol Diagram (Peripheral Mode)
       6. 8.10.6  LVDS Interface Configuration
          1. 8.10.6.1 LVDS Interface Timings
       7. 8.10.7  General-Purpose Input/Output
          1. 8.10.7.1 Switching Characteristics for Output Timing versus Load Capacitance (CL)
       8. 8.10.8  Controller Area Network - Flexible Data-rate (CAN-FD)
          1. 8.10.8.1 Dynamic Characteristics for the CANx TX and RX Pins
       9. 8.10.9  Serial Communication Interface (SCI)
          1. 8.10.9.1 SCI Timing Requirements
       10. 8.10.10 Inter-Integrated Circuit Interface (I2C)
           1. 8.10.10.1 I2C Timing Requirements
       11. 8.10.11 Quad Serial Peripheral Interface (QSPI)
           1. 8.10.11.1 QSPI Timing Conditions
           2. 8.10.11.2 Timing Requirements for QSPI Input (Read) Timings
           3. 8.10.11.3 QSPI Switching Characteristics
       12. 8.10.12 ETM Trace Interface
           1. 8.10.12.1 ETMTRACE Timing Conditions
           2. 8.10.12.2 ETM TRACE Switching Characteristics
       13. 8.10.13 Data Modification Module (DMM)
           1. 8.10.13.1 DMM Timing Requirements
       14. 8.10.14 JTAG Interface
           1. 8.10.14.1 JTAG Timing Conditions
           2. 8.10.14.2 Timing Requirements for IEEE 1149.1 JTAG
           3. 8.10.14.3 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
9. 9 Detailed Description
   1. 9.1 Overview
   2. 9.2 Functional Block Diagram
   3. 9.3 Subsystems
      1. 9.3.1 RF and Analog Subsystem
         1. 9.3.1.1 Clock Subsystem
         2. 9.3.1.2 Transmit Subsystem
         3. 9.3.1.3 Receive Subsystem
      2. 9.3.2 Processor Subsystem
      3. 9.3.3 Automotive Interface
      4. 9.3.4 Host Interface
      5. 9.3.5 Main Subsystem Cortex-R4F
      6. 9.3.6 DSP Subsystem
      7. 9.3.7 Hardware Accelerator
   4. 9.4 Other Subsystems
      1. 9.4.1 ADC Channels (Service) for User Application
         1. 9.4.1.1 GP-ADC Parameter
10. 10Monitoring and Diagnostics
    1. 10.1 Monitoring and Diagnostic Mechanisms
       1. 10.1.1 Error Signaling Module
11. 11Applications, Implementation, and Layout
    1. 11.1 Application Information
    2. 11.2 Reference Schematic
12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Tools and Software
    3. 12.3 Documentation Support
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 术语表
13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Packaging Information
    2. 13.2 Tray Information for ALP, 15 × 15 mm