SWRS283A June   2022  – November 2022 IWR6243

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Functional Block Diagram
  5. Revision History
  6. Device Comparison
    1. 6.1 Related Products
  7. Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Signal Descriptions
  8. Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Power-On Hours (POH)
    4. 8.4 Recommended Operating Conditions
    5. 8.5 Power Supply Specifications
    6. 8.6 Power Consumption Summary
    7. 8.7 RF Specification
    8. 8.8 Thermal Resistance Characteristics for FCBGA Package [ABL0161]
    9. 8.9 Timing and Switching Characteristics
      1. 8.9.1 Power Supply Sequencing and Reset Timing
      2. 8.9.2 Synchronized Frame Triggering
      3. 8.9.3 Input Clocks and Oscillators
        1. 8.9.3.1 Clock Specifications
      4. 8.9.4 Multibuffered / Standard Serial Peripheral Interface (MibSPI)
        1. 8.9.4.1 Peripheral Description
          1. 8.9.4.1.1 SPI Timing Conditions
          2. 8.9.4.1.2 SPI Peripheral Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output)
          3. 8.9.4.1.3 SPI Peripheral Mode Timing Requirements (SPICLK = input, SPISIMO = input, and SPISOMI = output)
        2. 8.9.4.2 Typical Interface Protocol Diagram (Peripheral Mode)
      5. 8.9.5 Inter-Integrated Circuit Interface (I2C)
        1. 8.9.5.1 I2C Timing Requirements
      6. 8.9.6 LVDS Interface Configuration
        1. 8.9.6.1 LVDS Interface Timings
      7. 8.9.7 General-Purpose Input/Output
        1. 8.9.7.1 Switching Characteristics for Output Timing versus Load Capacitance (CL)
      8. 8.9.8 Camera Serial Interface (CSI2)
        1. 8.9.8.1 CSI2 Switching Characteristics
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Subsystems
      1. 9.3.1 RF and Analog Subsystem
        1. 9.3.1.1 Clock Subsystem
        2. 9.3.1.2 Transmit Subsystem
        3. 9.3.1.3 Receive Subsystem
      2. 9.3.2 Host Interface
    4. 9.4 Other Subsystems
      1. 9.4.1 ADC Data Format Over CSI2 Interface
      2. 9.4.2 ADC Channels (Service) for User Application
        1. 9.4.2.1 GPADC Parameters
  10. 10Monitoring and Diagnostic Mechanisms
  11. 11Applications, Implementation, and Layout
    1. 11.1 Application Information
    2. 11.2 Radar Sensor for Industrial Applications
    3. 11.3 Imaging Radar using Cascade Configuration
  12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Documentation Support
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Export Control Notice
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Packaging Information
    2.     Package Option Addendum
    3. 13.2 Tape and Reel Information
    4.     Tray Information
    5.     Mechanical Data

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • ABL|161
散热焊盘机械数据 (封装 | 引脚)
订购信息

Features

  • FMCW transceiver
    • Integrated PLL, transmitter, receiver, baseband, and ADC
    • 57- to 64-GHz coverage with 7 GHz available bandwidth
    • Four receive channels
    • Three transmit channels
    • Supports 6-bit phase shifter for TX Beam forming
    • Ultra-accurate chirp engine based on Fractional-N PLL
    • TX power: 12 dBm
    • RX noise figure: 10 dB
    • Phase noise at 1 MHz:
      • –93dBc/Hz
  • Built-in calibration and self-test
    • Self-calibrating system across process and temperature
  • Host interface
    • Control interface with external processor over SPI or I2C interface
    • Data interface with external processor over MIPI D-PHY, CSI2 v1.1 and LVDS (only for debug)
    • Interrupts for Fault Reporting
  • Functional Safety-Compliant
    • Developed for functional safety applications
    • Documentation available to aid IEC 61508 functional safety system design up to SIL 3
    • Hardware integrity up to SIL-2
    • Safety-related certification
      • IEC 61508 certified SIL-2 by TUV SUD
  • IWR6243 Advanced features
    • Embedded self-monitoring with limited Host processor involvement
    • Complex baseband architecture
    • Option of cascading multiple devices to increase channel count
    • Embedded interference detection capability
  • Power management
    • Built-in LDO Network for enhanced PSRR
    • I/Os support dual voltage 3.3 V/1.8 V
  • Clock source
    • Supports externally driven clock (square/sine) at 40 MHz
    • Supports 40 MHz crystal connection with load capacitors
  • Easy hardware design
    • 0.65-mm pitch, 161-pin 10.4 mm × 10.4 mm flip chip BGA package for easy assembly and low-cost PCB design
    • Small solution size
  • Operating Condtions :
    • Junction temp range: –40°C to 105°C
GUID-20210127-CA0I-6WPF-FPSV-HRHLQWMZQG2H-low.gifFigure 1-1 Radar Sensor for Industrial Applications