SN74LVC2G34 Dual Buffer Gate

1 Features

• Available in the Texas Instruments
  NanoFree™ Package
• Supports 5.5-V V_CC Operation
• Inputs Accept Voltages to 5.5 V
• Maximum t_pd of 4.1 ns at 3.3 V
• Low Power Consumption, 10-µA Maximum I_CC
• ±24-mA Output Drive at 3.3 V
• Typical V_OLP (Output Ground Bounce)
  <0.8 V at V_CC = 3.3 V, T_A = 25°C
• Typical V_OHV (Output V_OH Undershoot)
  >2 V at V_CC = 3.3 V, T_A = 25°C
• I_off Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
• Can Be Used as a Down Translator to Translate Inputs From a Maximum of 5.5 V Down to the V_CC Level
• Latch-Up Performance Exceeds 100 mA Per
  JESD 78, Class II
• ESD Protection Exceeds JESD 22
  • 2000-V Human Body Model (A114-A)
  • 200-V Machine Model (A115-A)
  • 1000-V Charged-Device Model (C101)

2 Applications

• AV Receivers
• Audio Docks: Portable
• Blu-ray Player and Home Theaters
• DVD Recorders and Players
• Embedded PCs
• MP3 Players and Recorders (Portable Audio)
• Personal Digital Assistant (PDA)
• Power: Telecom/Server AC/DC Supply: Single Controller: Analog and Digital
• Solid-State Drive (SSD): Client and Enterprise
• TV: LCD/Digital and High-Definition (HDTV)
• Tablets: Enterprise
• Video Analytics: Servers
• Wireless Headsets, Keyboards, and Mice

3 Description

The SN74LVC2G34 device is a dual buffer gate designed for 1.65-V to 5.5-V V_CC operation. The SN74LVC2G34 device performs the Boolean function Y = A in positive logic.

NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

1. For all available packages, see the orderable addendum at the end of the data sheet.

Simplified Schematic

4 Revision History

Changes from I Revision (December 2013) to J Revision

• Added Applications, Device Information table, Pin Configuration and Functions section, ESD Ratings table, Thermal Information table, Typical Characteristics section, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
• Deleted part number from Switching Characteristics table headers.Go

Changes from H Revision (February 2007) to I Revision

• Updated document to new TI data sheet format.Go
• Removed Ordering Information table.Go
• Updated Features sectionGo
• Updated operating temperature range.Go

5 Pin Configuration and Functions

DBV Package

6-Pin SOT-23

Top View

DRL Package

6-Pin SOT

Top View

DCK Package

6-Pin SC70

Top View

YZP Package

6-Pin DSBGA

Bottom View