TCA6507 Low-Voltage 7-Bit I2C and SMBus LED Driver With Intensity Control and Shutdown
- SCPS164D MAY 2007 – February 2017 TCA6507
  
  PRODUCTION DATA.

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DATA SHEET

TCA6507 Low-Voltage 7-Bit I2C and SMBus LED Driver With Intensity Control and Shutdown

1 Features

Seven LED Driver Outputs: ON, OFF, Blinking, Fading at Programmable Rates
Open-Drain Outputs Directly Drive LEDs to
40-mA Maximum
Two Independent Banks of LED Drivers
Widely Programmable Blink Rates, Fade-ON and Fade-OFF Rates and Maximum Intensity
Outputs Not Used as LED Drivers Can Be Used as Regular General-Purpose Open-Drain Outputs
16 Steps of Maximum Intensity Control from
Fully-OFF to Fully-ON States
Smooth Perceived Transitions for Fade-ON and Fade-OFF
Operating Power-Supply Voltage Range of
1.65 V to 3.6 V
5.5-V Tolerant Open-Drain Outputs
Low Standby Current With Shutdown Capability for Additional Power Savings
Programmed Through I²C Bus Interface Logic Compatible With SMBus
No Glitch on Power Up
ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II

2 Applications

Mobile Phones
Desktop and Laptop Computers
Human Machine Interface

3 Description

This 7-bit LED dimmer for the two-line bidirectional bus (I²C) is designed to control (or dim) LEDs through the I²C interface. Without this device, the microcontroller must be actively involved in turning on and off the LEDs (per the required dimming rate), which uses valuable processor time. The TCA6507 alleviates this issue by limiting the number of operations required by the processor in blinking LEDs and helps to create a more efficient system. The TCA6507 handles all pulse width modulation (PWM) logic, allowing the processor to use its cycles for more important tasks.

Device Information⁽¹⁾

PART NUMBER	PACKAGE	BODY SIZE (NOM)
TCA6507	TSSOP (14)	5.00 mm × 4.40 mm
	BGA MICROSTAR JUNIOR (12)	2.00 mm × 2.50 mm
	X2QFN (12)	2.00 mm × 1.40 mm

For all available packages, see the orderable addendum at the end of the data sheet.

Simplified Schematic

4 Revision History

Changes from C Revision (January 2016) to D Revision

Changed f_INT value From: MIN = 23 and MAX = 43 To: MIN = 28 and MAX = 58 in the Electrical Characteristics tableGo
Changed V_POR values From: TYP = 1.4 To: TYP = 1.1 MAX = 1.4 in the Electrical Characteristics tableGo
Changed Operating I_CC MAX value From: 25 To: 40 in the Electrical Characteristics tableGo
Changed C_i, C_io, C_o TYP and MAX values in the Electrical Characteristics tableGo
Changed The I²C Interface Timing Requirements tableGo
Changed TheOscillator Timing Requirements tableGo
Changed TheSwitching Characteristics tableGo
Updated Typical Characteristic CurvesGo
Changed Table 18, Brightness Register ValuesGo
Changed Table 26 Go

Changes from B Revision (November 2007) to C Revision

Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo

5 Pin Configuration and Functions

PW Package

14-Pin TSSOP

Top View

RUE Package

12-Pin X2QFN

Top View

Pin Functions –TSSOP and X2QFN

PIN			I/O	DESCRIPTION
NAME	NO.
NAME	PW	RUE
EN	4	4	I	Enable input. If set to low, it puts the TCA6507 in shutdown mode and resets the internal registers and I²C/SMBus state machine to their default states
GND	5	5	—	Ground
P0	8	6	O	P-port output 0. Open-drain design structure
P1	9	7	O	P-port output 1. Open-drain design structure
P2	10	8	O	P-port output 2. Open-drain design structure
P3	11	9	O	P-port output 3. Open-drain design structure
P4	12	10	O	P-port output 4. Open-drain design structure
P5	13	11	O	P-port output 5. Open-drain design structure
P6	14	12	O	P-port output 6. Open-drain design structure
SDA	3	3	I/O	Serial data bus. Connect to V_CC through a pull-up resistor
SCL	2	2	I	Serial clock bus. Connect to V_CC through a pull-up resistor
V_CC	1	1	—	Supply voltage of I²C registers, oscillator, and control logic. Connect directly to V_CC of the external I²C master. Provides voltage-level translation

ZXU Package

12-Pin BGA MICROSTAR JUNIOR

Top View

Table 1. ZXU Package Terminal Assignments

	C	B	A
1	P1	P2	GND
2	P3	EN	SDA
3	P4	P0	SCL
4	P5	P6	V_CC

Pin Functions –BGA Microstar Junior

PIN		I/O	DESCRIPTION
NO.	NAME	I/O	DESCRIPTION
A1	GND	—	Ground
A2	SDA	I/O	Serial data bus. Connect to V_CC through a pullup resistor
A3	SCL	I	Serial clock bus. Connect to V_CC through a pullup resistor
A4	V_CC	—	Supply voltage of I²C registers, oscillator, and control logic. Connect directly to V_CC of the external I²C master. Provides voltage-level translation
B1	P2	O	P-port output 2. Open-drain design structure
B2	EN	I	Enable input. If set to low, it puts the TCA6507 in shutdown mode and resets the internal registers and I²C/SMBus state machine to their default states
B3	P0	O	P-port output 0. Open-drain design structure
B4	P6	O	P-port output 6. Open-drain design structure
C1	P1	O	P-port output 1. Open-drain design structure
C2	P3	O	P-port output 3. Open-drain design structure
C3	P4	O	P-port output 4. Open-drain design structure
C4	P5	O	P-port output 5. Open-drain design structure

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

				MIN	MAX	UNIT
V_CC	Supply voltage			–0.5	4.6	V
V_I	Input voltage⁽²⁾			–0.5	6.5	V
V_O	Output voltage⁽²⁾				6.5	V
I_IK	Input clamp current	V_I < 0	SCL, EN		±20	mA
I_OK	Output clamp current	V_O < 0 or V_O > V_CC	P port, SDA		±20	mA
I_OL	Continuous output low current	V_O = 0 to V_CC	P port		50	mA
I_OL	Continuous output low current	V_O = 0 to V_CC	SDA		25	mA
I_CC	Continuous current through GND				250	mA
I_CC	Continuous current through V_CC				20	mA
T_stg	Storage temperature			–65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

6.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾	±2000	V
V_(ESD)	Electrostatic discharge	Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾	±1000	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

				MIN	MAX	UNIT
V_CC	Supply voltage of I²C registers, oscillator, and control logic			1.65	3.6	V
V_IH	High-level input voltage	SCL, SDA, EN	1.65 V ≤ V_CC ≤ 1.95 V	1.3	3.6	V
V_IH	High-level input voltage	SCL, SDA, EN	1.96 V ≤ V_CC ≤ 3.6 V	0.7 × V_C_C	3.6	V
V_IL	Low-level input voltage	SCL, SDA, EN	1.65 V ≤ V_CC ≤ 1.95 V	–0.5	0.3	V
V_IL	Low-level input voltage	SCL, SDA, EN	1.96 V ≤ V_CC ≤ 3.6 V	–0.5	0.3 × V_CC	V
V_O	Output voltage			0	5.5	V
I_OL	Low-level output current ⁽¹⁾				40	mA
T_A	Operating free-air temperature			–40	85	°C

(1) The total current sourced by the P port must be limited to 200 mA.

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		TCA6507			UNIT
		PW (TSSOP)	ZXU (BGA MICROSTAR JUNIOR)	RUE (X2QFN)
		14 PINS	12 PINS	12 PINS
R_θJA	Junction-to-ambient thermal resistance	127.2	155.2	181	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	55.8	99.4	80.4	°C/W
R_θJB	Junction-to-board thermal resistance	38.9	91.5	95.3	°C/W
ψ_JT	Junction-to-top characterization parameter	9.3	6.8	3.5	°C/W
ψ_JB	Junction-to-board characterization parameter	68.3	92.1	95.3	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

GND = 0 V, T_A = –40°C to +85°C

PARAMETER		TEST CONDITIONS	V_CC	MIN	TYP⁽¹⁾	MAX	UNIT
f_INT	Intensity control clock frequency	Operating mode	1.65 V to 3.6 V	28	32	58	kHz
V_IK	Input diode clamp voltage	I_I = –18 mA	1.65 V to 3.6 V	–1.2			V
V_POR	Power-on reset voltage	V_I = V_CC or GND, I_O = 0	1.65 V to 3.6 V		1.1	1.4	V
V_OL	SDA	I_OL = 6 mA	1.65 V to 3.6 V		0.2	0.6	V
I_OL	SDA		1.65 V to 3.6 V	3	13.2		mA
	P port⁽²⁾	V_OL = 0.5 V	1.65 V	25	59.7		mA
	P port⁽²⁾	V_OL = 0.6 V	1.8 V to 3.6 V	40	68		mA
I_I	SCL, SDA, EN	V_I = V_CC or GND, V_CC ≥ 1.65 V	1.65 V to 3.6 V			±0.1	μA
I_CC	Standby current	EN disabled, P port idle, Intensity control disabled, SCL = V_CC, SDA = V_CC, I_O = 0, f_SCL = 0	1.65 V to 1.95 V		2	12	μA
	Standby current		1.96 V to 3.6 V		3	15	μA
	Operating mode	P port running, Intensity control enabled, SCL = V_CC, SDA = V_CC, I_O = 0, f_SCL = 0	1.65 V to 1.95 V		9.7	17	μA
			1.96 V to 3.6 V		10.4	20
		P port running, Intensity control enabled, SDA = V_CC, I_O = 0, f_SCL = 400 kHz, t_r = 300 ns	1.65 V to 1.95 V		10.2	18
			1.96 V to 3.6 V		11.4	40
C_i	SCL		1.65 V to 3.6 V		7	10	pF
C_io	SDA	V_IO = V_CC or GND	1.65 V to 3.6 V		8	11	pF
C_o	P port	V_O = V_CC or GND	1.65 V to 3.6 V		7	10	pF

(1) All typical values are at T_A = 25°C.

(2) The total current sourced by the P port must be limited to 200 mA.

6.6 I²C Interface Timing Requirements

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 8)

			MIN	MAX	UNIT
STANDARD MODE
f_scl	I²C clock frequency		0	100	kHz
t_sch	I²C clock high time		4		μs
t_scl	I²C clock low time		4.7		μs
t_sp	I²C spike time			50	ns
t_sds	I²C serial-data setup time		250		ns
t_sdh	I²C serial-data hold time		0		ns
t_icr	I²C input rise time			1000	ns
t_icf	I²C input fall time			300	ns
t_ocf	I²C output fall time	10-pF to 400-pF bus		300	ns
t_buf	I²C bus free time between STOP and START conditions		4.7		μs
t_sts	I²C START or repeated START condition setup		4.7		μs
t_sth	I²C START or repeated START condition hold		4		μs
t_sps	I²C STOP condition setup		4		μs
t_vd(data)	Valid-data time	SCL low to SDA output valid		1	μs
t_vd(ack)	Valid-data time of ACK condition	ACK signal from SCL low to SDA (out) low		1	μs
C_b	I²C bus capacitive load		0	400	pF
FAST MODE
f_scl	I²C clock frequency		0	400	kHz
t_sch	I²C clock high time		0.6		μs
t_scl	I²C clock low time		1.3		μs
t_sp	I²C spike time			50	ns
t_sds	I²C serial-data setup time		100		ns
t_sdh	I²C serial-data hold time		0		ns
t_icr	I²C input rise time		20	300	ns
t_icf	I²C input fall time		20 × (V_CC / 5.5 V)	300	ns
t_ocf	I²C output fall time	10-pF to 400-pF bus	20 × (V_CC / 5.5 V)	300	ns
t_buf	I²C bus free time between STOP and START conditions		1.3		μs
t_sts	I²C START or repeated START condition setup		0.6		μs
t_sth	I²C START or repeated START condition hold		0.6		μs
t_sps	I²C STOP condition setup		0.6		μs
t_vd(data)	Valid-data time	SCL low to SDA output valid		1	μs
t_vd(ack)	Valid-data time of ACK condition	ACK signal from SCL low to SDA (out) low		1	μs
C_b	I²C bus capacitive load		0	400	pF

6.7 Oscillator Timing Requirements

over recommended operating free-air temperature range (unless otherwise noted)

		MIN	MAX	UNIT
STANDARD and FAST MODE
t_OSC	Oscillator start-up time from power-down or shutdown mode to fully on at 32 kHz	5		ms

6.8 Switching Characteristics

over recommended operating free-air temperature range, C_L ≤ 100 pF (unless otherwise noted)

PARAMETER		FROM (INPUT)	TO (OUTPUT)	MIN	MAX	UNIT
STANDARD and FAST MODE
t_pv	Output data valid (in general-purpose output mode)	SCL	P port		400	ns
t_ps	Shutdown data valid	EN (low)	P port (high)		70	μs
t_w	EN pulse duration			60		μs

6.9 Typical Characteristics

EN is Low (PWM Disabled)

f_SCL = 0

Figure 1. Standby Current vs Temperature

EN is High (PWM Enabled)

f_SCL = 400 kHz

Figure 3. Supply Current vs Temperature

Figure 5. Port Output Low Voltage vs Temperature

Figure 7. Output Low Voltage vs Sink Current

EN is Low (PWM Enabled)

f_SCL = 0

Figure 2. Supply Current vs Temperature

Figure 4. Port Output Low Voltage vs Temperature

Figure 6. PWM Frequency vs Temperature