ZHCSMK8A December   2020  – April 2021 TPS7B87-Q1

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power-Good (PG)
      2. 7.3.2 Adjustable Power-Good Delay Timer (DELAY)
      3. 7.3.3 Undervoltage Lockout
      4. 7.3.4 Thermal Shutdown
      5. 7.3.5 Current Limit
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input and Output Capacitor Selection
      2. 8.1.2 Dropout Voltage
      3. 8.1.3 Reverse Current
      4. 8.1.4 Power Dissipation (PD)
        1. 8.1.4.1 Thermal Performance Versus Copper Area
        2. 8.1.4.2 Power Dissipation Versus Ambient Temperature
      5. 8.1.5 Estimating Junction Temperature
      6. 8.1.6 Pulling Up the PG Pin to a Different Voltage
      7. 8.1.7 Power-Good
        1. 8.1.7.1 Setting the Adjustable Power-Good Delay
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Capacitor
        2. 8.2.2.2 Output Capacitor
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Package Mounting
      2. 10.1.2 Board Layout Recommendations to Improve PSRR and Noise Performance
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
      2. 11.1.2 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 静电放电警告
    7. 11.7 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

特性

  • 符合面向汽车应用的 AEC-Q100 标准:
    • 温度等级 1:–40°C 至 +125°C,TA
    • 结温:–40°C 至 +150°C,TJ
  • 输入电压范围:3V 至 40V(最大 42V)
  • 输出电压范围:3.3V 和 5V(固定)
  • 最大输出电流:500mA
  • 输出电压精度:±0.85%(最大值)
  • 低压降:
    • 450mA 时为 475 mV(最大值)
  • 低静态电流:
    • 轻负载时典型值为 17µA
  • 出色的线路瞬态响应:
    • 冷启动时出现 ±2% VOUT 偏差
    • ±2% VOUT 偏差(VIN 压摆率 1V/µs)
  • 具有可编程延迟周期的电源正常状态指示
  • 与 2.2µF 或更高的电容器搭配使用时可保持稳定
  • 提供功能安全
    • 可帮助进行功能安全系统设计的文档
  • 封装选项:
    • 5 引脚 TO-252 封装:29.7°C/W RθJA
    • 带有散热焊盘的 8 引脚 HSOIC-8 封装:41.8°C/W RθJA