SLPS235D October 2009 – November 2016 CSD16301Q2
PRODUCTION DATA.
This 25-V, 19-mΩ, 2-mm × 2-mm SON NexFET™ power MOSFET has been designed to minimize losses in power conversion and load management applications. The 2-mm × 2-mm SON package offers excellent thermal performance for the size of the package.
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TA = 25°C | TYPICAL VALUE | UNIT | ||
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VDS | Drain-to-Source Voltage | 25 | V | |
Qg | Gate Charge Total (4.5 V) | 2 | nC | |
Qgd | Gate Charge Gate-to-Drain | 0.4 | nC | |
RDS(on) | Drain-to-Source On Resistance | VGS = 3 V | 27 | mΩ |
VGS = 4.5 V | 23 | |||
VGS = 8 V | 19 | |||
VGS(th) | Threshold Voltage | 1.1 | V |
DEVICE | QTY | MEDIA | PACKAGE | SHIP |
---|---|---|---|---|
CSD16301Q2 | 3000 | 7-Inch Reel | SON 2.00-mm × 2.00-mm Plastic Package |
Tape and Reel |
CSD16301Q2T | 250 |
TA = 25°C | VALUE | UNIT | |
---|---|---|---|
VDS | Drain-to-Source Voltage | 25 | V |
VGS | Gate-to-Source Voltage | +10 / –8 | V |
ID | Continuous Drain Current (Package Limited) | 5 | A |
Continuous Drain Current (Silicon Limited), TC = 25°C | 20 | ||
Continuous Drain Current(1) | 8.2 | ||
IDM | Pulsed Drain Current(2) | 85 | A |
PD | Power Dissipation(1) | 2.5 | W |
Power Dissipation, TC = 25°C | 15 | ||
TJ, TSTG |
Operating Junction, Storage Temperature |
–55 to 150 | °C |
EAS | Avalanche Energy, Single Pulse ID = 14 A, L = 0.1 mH, RG = 25 Ω |
10 | mJ |
RDS(on) vs VGS |
Gate Charge |