Espen Wium
Today, the Bluetooth SIG announced its 2016 technology road map to include enhancements for the standard that is focused on increasing functionality with the Internet of Things (IoT). Key updates include longer range, higher speeds and mesh networking. These updates will not only enhance existing Bluetooth low energy use cases but will allow the creation of innovative new products using Bluetooth low energy.
Our new and highly flexible SimpleLink™ ultra-low power CC2640 wireless microcontroller (MCU), released in February 2015 to mass production , was designed with the Bluetooth® low energy 2016 standard enhancements in mind. The radio core is in itself a flexible multi-core system of MCUs that run firmware implementations of the various standards supported. As a result, updates to the RF protocol are supported by a simple firmware update. As the Bluetooth core spec is updated in 2016, TI will introduce CC2640 product updates that allow these new PHYs to be used to their full potential integrated into a Bluetooth low energy software stack. Customers who would like to pursue this path can already start developing on the CC2640 wireless MCU today.
So what are these new capabilities?
Product demonstrations and SDKs supporting the new Bluetooth low energy standard will be available based on the Bluetooth SIG’s schedule in 2016.
To start developing your Bluetooth low energy application today, visit the TI’s SimpleLink Bluetooth low energy CC2640 wireless MCU product folder and order a SensorTag kit that can connect your application to the cloud in less than three minutes. Use the Bluetooth Developer Studio to quickly develop your Bluetooth low energy application using TI’s BLE-Stack SDK.
Have additional questions? Ask our engineer experts on the E2E Bluetooth low energy forum.
Order the new SimpleLink CC2650 LaunchPad™ development kit now to quickly kick start development!
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023, Texas Instruments Incorporated