ZHCSHA6E
May 2009 – January 2018
ADS1013
,
ADS1014
,
ADS1015
PRODUCTION DATA.
1
特性
2
应用
3
说明
Device Images
简化的方框图
4
Revision History
5
Device Comparison Table
6
Pin Configuration and Functions
Pin Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Timing Requirements: I2C
7.7
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagrams
8.3
Feature Description
8.3.1
Multiplexer
8.3.2
Analog Inputs
8.3.3
Full-Scale Range (FSR) and LSB Size
8.3.4
Voltage Reference
8.3.5
Oscillator
8.3.6
Output Data Rate and Conversion Time
8.3.7
Digital Comparator (ADS1014 and ADS1015 Only)
8.3.8
Conversion Ready Pin (ADS1014 and ADS1015 Only)
8.3.9
SMbus Alert Response
8.4
Device Functional Modes
8.4.1
Reset and Power-Up
8.4.2
Operating Modes
8.4.2.1
Single-Shot Mode
8.4.2.2
Continuous-Conversion Mode
8.4.3
Duty Cycling For Low Power
8.5
Programming
8.5.1
I2C Interface
8.5.1.1
I2C Address Selection
8.5.1.2
I2C General Call
8.5.1.3
I2C Speed Modes
8.5.2
Slave Mode Operations
8.5.2.1
Receive Mode
8.5.2.2
Transmit Mode
8.5.3
Writing To and Reading From the Registers
8.5.4
Data Format
8.6
Register Map
8.6.1
Address Pointer Register (address = N/A) [reset = N/A]
Table 4.
Address Pointer Register Field Descriptions
8.6.2
Conversion Register (P[1:0] = 0h) [reset = 0000h]
Table 5.
Conversion Register Field Descriptions
8.6.3
Config Register (P[1:0] = 1h) [reset = 8583h]
Table 6.
Config Register Field Descriptions
8.6.4
Lo_thresh (P[1:0] = 2h) [reset = 8000h] and Hi_thresh (P[1:0] = 3h) [reset = 7FFFh] Registers
Table 7.
Lo_thresh and Hi_thresh Register Field Descriptions
9
Application and Implementation
9.1
Application Information
9.1.1
Basic Connections
9.1.2
Single-Ended Inputs
9.1.3
Input Protection
9.1.4
Unused Inputs and Outputs
9.1.5
Analog Input Filtering
9.1.6
Connecting Multiple Devices
9.1.7
Quickstart Guide
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
Shunt Resistor Considerations
9.2.2.2
Operational Amplifier Considerations
9.2.2.3
ADC Input Common-Mode Considerations
9.2.2.4
Resistor (R1, R2, R3, R4) Considerations
9.2.2.5
Noise and Input Impedance Considerations
9.2.2.6
First-order RC Filter Considerations
9.2.2.7
Circuit Implementation
9.2.2.8
Results Summary
9.2.3
Application Curves
10
Power Supply Recommendations
10.1
Power-Supply Sequencing
10.2
Power-Supply Decoupling
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
器件和文档支持
12.1
Documentation Support
12.1.1
Related Documentation
12.2
相关链接
12.3
Receiving Notification of Documentation Updates
12.4
Community Resources
12.5
商标
12.6
静电放电警告
12.7
Glossary
13
机械、封装和可订购信息
1
特性
超小型 X2QFN 封装:
2mm × 1.5mm × 0.4mm
12 位无噪声分辨率
宽电源电压:2.0V 至 5.5V
低流耗:150μA
(连续转换模式)
可编程数据速率:
128SPS 至 3.3kSPS
单周期稳定
内部低漂移电压基准
内部振荡器
I
2
C 接口:四个可通过引脚选择的地址
四个单端输入或两个差分输入 (ADS1015)
可编程比较器(ADS1014 和 ADS1015)
工作温度范围:
-40°C 至 +125°C
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