ZHCSH86B
December 2017 – February 2019
LMH5401-SP
PRODUCTION DATA.
1
特性
2
应用
3
说明
Device Images
LMH5401-SP 小信号频率响应
LMH5401-SP 驱动 ADC12D1620QML
4
修订历史记录
5
说明 (续)
6
Pin Configuration and Functions
Pin Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics: VS = 5 V
7.6
Electrical Characteristics: VS = 3.3 V
7.7
Typical Characteristics: 5 V
7.8
Typical Characteristics: 3.3 V
8
Parameter Measurement Information
8.1
Output Reference Nodes and Gain Nomenclature
8.2
ATE Testing and DC Measurements
8.3
Frequency Response
8.4
S-Parameters
8.5
Frequency Response with Capacitive Load
8.6
Distortion
8.7
Noise Figure
8.8
Pulse Response, Slew Rate, and Overdrive Recovery
8.9
Power Down
8.10
VCM Frequency Response
8.11
Test Schematics
9
Detailed Description
9.1
Overview
9.2
Functional Block Diagram
9.3
Feature Description
9.3.1
Fully-Differential Amplifier
9.3.2
Operations for Single-Ended to Differential Signals
9.3.2.1
AC-Coupled Signal Path Considerations for Single-Ended Input to Differential Output Conversion
9.3.2.2
DC-Coupled Input Signal Path Considerations for SE-DE Conversions
9.3.2.3
Resistor Design Equations for Single-to-Differential Applications
9.3.2.4
Input Impedance Calculations
9.3.3
Differential-to-Differential Signals
9.3.3.1
AC-Coupled, Differential-Input to Differential-Output Design Issues
9.3.3.2
DC-Coupled, Differential-Input to Differential-Output Design Issues
9.3.4
Output Common-Mode Voltage
9.4
Device Functional Modes
9.4.1
Operation With a Split Supply
9.4.2
Operation With a Single Supply
10
Application and Implementation
10.1
Application Information
10.1.1
Stability, Noise Gain, and Signal Gain
10.1.2
Input and Output Headroom Considerations
10.1.3
Noise Analysis
10.1.4
Noise Figure
10.1.5
Thermal Considerations
10.2
Typical Application
10.2.1
Design Requirements
10.2.2
Detailed Design Procedure
10.2.2.1
Driving Matched Loads
10.2.2.2
Driving Unmatched Loads For Lower Loss
10.2.2.3
Driving Capacitive Loads
10.2.2.4
Driving ADCs
10.2.2.4.1
SNR Considerations
10.2.2.4.2
SFDR Considerations
10.2.2.4.3
ADC Input Common-Mode Voltage Considerations—AC-Coupled Input
10.2.2.4.4
ADC Input Common-Mode Voltage Considerations—DC-Coupled Input
10.2.2.5
GSPS ADC Driver
10.2.2.6
Common-Mode Voltage Correction
10.2.2.7
Active Balun
10.2.3
Application Curves
10.3
Do's and Don'ts
10.3.1
Do:
10.3.2
Don't:
11
Power Supply Recommendations
11.1
Supply Voltage
11.2
Single Supply
11.3
Split Supply
11.4
Supply Decoupling
12
Layout
12.1
Layout Guidelines
12.2
Layout Example
13
器件和文档支持
13.1
器件支持
13.1.1
器件命名规则
13.2
文档支持
13.2.1
相关文档
13.3
接收文档更新通知
13.4
社区资源
13.5
商标
13.6
静电放电警告
13.7
术语表
14
机械、封装和可订购信息
封装选项
机械数据 (封装 | 引脚)
FFK|14
MCCC005A
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsh86b_oa
zhcsh86b_pm
1
特性
QMLV(QML V 类)已通过 MIL-PRF-38535 认证,SMD 5962R1721401VXC
耐辐射加固保障 (RHA) 能力高达 100krad (Si) 总电离剂量 (TID)
单粒子闩锁 (SEL) 对于
LET 的抗扰度 = 85MeV-cm
2
/mg
支持军用级温度范围(-55°C 至 125°C)
增益带宽积 (GBP):6.5GHz
优异的线性性能:
直流电频率达 2GHz
压摆率:17,500V/µs
低 HD2、HD3 失真
(500mV
PP
,100Ω,SE-DE,Gv = 17dB)
(1)
:
100MHz:HD2 为 -91dBc,HD3 为 -95dBc
200MHz:HD2 为 -86dBc,HD3 为 -85dBc
500MHz:HD2 为 -80dBc,HD3 为 -80dBc
1GHz:HD2 为 -53dBc,HD3 为 -70dBc
2GHz:HD2 为 -68dBc,HD3 为 -56dBc
低 IMD2、IMD3 失真
(1V
PP
,100Ω,SE-DE,Gv = 17dB)
(1)
:
500MHz:IMD2 为 –90dBc,IMD3 为 –79dBc
1GHz:IMD2 为 –80dBc,IMD3 为 –61dBc
2GHz:IMD2 为 –64dBc,IMD3 为 –42dBc
高 OIP2、OIP3。Gp = 8dB
(1)
500MHz:OIP2 为 91dBm,OIP3 为 47.7dBm
1 GHz:OIP2 为 80dBm,OIP3 为 37.5dBm
输入电压噪声:1.25nV/√
Hz
输入电流噪声:3.5pA/√
Hz
支持单电源和双电源运行
电流消耗:60mA
关断特性
(1)
1.
功率增益 (Gp) = 8dB;电压增益 (Gv) = 17dB;RL
总计
= 200Ω。更多详细信息请参见
输出参考节点和增益命名规则
部分。
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