ZHCSO27B May   2021  – December 2022 TPS7H4002-SP

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  VIN and Power VIN Pins (VIN and PVIN)
      2. 7.3.2  Voltage Reference
      3. 7.3.3  Adjusting the Output Voltage
      4. 7.3.4  Safe Start-Up Into Prebiased Outputs
      5. 7.3.5  Error Amplifier
      6. 7.3.6  Slope Compensation
      7. 7.3.7  Enable and Adjust UVLO
      8. 7.3.8  Adjustable Switching Frequency and Synchronization (SYNC)
      9. 7.3.9  Slow Start (SS/TR)
      10. 7.3.10 Power Good (PWRGD)
      11. 7.3.11 Sequencing (SS/TR)
      12. 7.3.12 Output Overvoltage Protection (OVP)
      13. 7.3.13 Overcurrent Protection
        1. 7.3.13.1 High-Side MOSFET Overcurrent Protection
        2. 7.3.13.2 Low-Side MOSFET Overcurrent Protection
      14. 7.3.14 Thermal Shutdown
      15. 7.3.15 Turn-On Behavior
      16. 7.3.16 Small Signal Model for Frequency Compensation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Fixed-Frequency PWM Control
      2. 7.4.2 Continuous Current Mode (CCM) Operation
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Operating Frequency
        2. 8.2.2.2 Output Inductor Selection
        3. 8.2.2.3 Output Capacitor Selection
        4. 8.2.2.4 Output Schottky Diode
        5. 8.2.2.5 Slow Start Capacitor Selection
        6. 8.2.2.6 Undervoltage Lockout (UVLO) Set Point
        7. 8.2.2.7 Output Voltage Feedback Resistor Selection
        8. 8.2.2.8 Compensation Component Selection
      3. 8.2.3 Parallel Operation
      4. 8.2.4 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

特性

  • 辐射性能:
    • 耐辐射保障高达
      TID 100krad(Si)
    • SEL、SEB 和 SEGR 对于
      LET 的抗扰度 = 75MeV-cm2/mg
    • SET 和 SEFI 的
      LET 特征值高达 75MeV-cm2/mg
  • 峰值效率:96.9%(VO = 2.5V)
  • 集成 50mΩ 和 35mΩ MOSFET
  • 电源轨:3V 至 5.5V(输入电压)
  • 3A 最大输出电流
  • 灵活的开关频率选项:
    • 100kHz 至 1MHz 可调内部振荡器
    • 外部同步功能:100 kHz 至 1 MHz
    • 可针对初级-次级应用将 SYNC 引脚配置为 500kHz 输出
  • 在温度、辐射以及线路和负载调节范围内提供 0.807V ±1.5% 的电压基准
  • 单调启动至预偏置输出
  • 通过外部电容器进行可调节的软启动
  • 用于电源定序的输入使能和电源正常输出
  • 针对欠压和过压问题的电源正常输出监控
  • 可调节输入欠压锁定 (UVLO)
  • 20 引脚超小热增强型 Ceramic Flatpack 封装 (HKH),适用于航天应用
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