SLASF60
april 2023
DAC53204-Q1
,
DAC63204-Q1
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics: Voltage Output
6.6
Electrical Characteristics: Current Output
6.7
Electrical Characteristics: Comparator Mode
6.8
Electrical Characteristics: General
6.9
Timing Requirements: I2C Standard Mode
6.10
Timing Requirements: I2C Fast Mode
6.11
Timing Requirements: I2C Fast Mode Plus
6.12
Timing Requirements: SPI Write Operation
6.13
Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 0)
6.14
Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 1)
6.15
Timing Requirements: GPIO
6.16
Timing Diagrams
6.17
Typical Characteristics: Voltage Output
6.18
Typical Characteristics: Current Output
6.19
Typical Characteristics: Comparator
6.20
Typical Characteristics: General
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Smart Digital-to-Analog Converter (DAC) Architecture
7.3.2
Digital Input/Output
7.3.3
Nonvolatile Memory (NVM)
7.4
Device Functional Modes
7.4.1
Voltage-Output Mode
7.4.1.1
Voltage Reference and DAC Transfer Function
7.4.1.1.1
Internal Reference
7.4.1.1.2
External Reference
7.4.1.1.3
Power-Supply as Reference
7.4.2
Current-Output Mode
7.4.3
Comparator Mode
7.4.3.1
Programmable Hysteresis Comparator
7.4.3.2
Programmable Window Comparator
7.4.4
Fault-Dump Mode
7.4.5
Application-Specific Modes
7.4.5.1
Voltage Margining and Scaling
7.4.5.1.1
High-Impedance Output and PROTECT Input
7.4.5.1.2
Programmable Slew-Rate Control
7.4.5.1.3
PMBus Compatibility Mode
7.4.5.2
Function Generation
7.4.5.2.1
Triangular Waveform Generation
7.4.5.2.2
Sawtooth Waveform Generation
7.4.5.2.3
Sine Waveform Generation
7.4.6
Device Reset and Fault Management
7.4.6.1
Power-On Reset (POR)
7.4.6.2
External Reset
7.4.6.3
Register-Map Lock
7.4.6.4
NVM Cyclic Redundancy Check (CRC)
7.4.6.4.1
NVM-CRC-FAIL-USER Bit
7.4.6.4.2
NVM-CRC-FAIL-INT Bit
7.4.7
Power-Down Mode
7.5
Programming
7.5.1
SPI Programming Mode
7.5.2
I2C Programming Mode
7.5.2.1
F/S Mode Protocol
7.5.2.2
I2C Update Sequence
7.5.2.2.1
Address Byte
7.5.2.2.2
Command Byte
7.5.2.3
I2C Read Sequence
7.5.3
General-Purpose Input/Output (GPIO) Modes
7.6
Register Map
7.6.1
NOP Register (address = 00h) [reset = 0000h]
7.6.2
DAC-X-MARGIN-HIGH Register (address = 01h, 07h, 0Dh, 13h) [reset = 0000h]
7.6.3
DAC-X-MARGIN-LOW Register (address = 02h, 08h, 0Eh, 14h) [reset = 0000h]
7.6.4
DAC-X-VOUT-CMP-CONFIG Register (address = 03h, 09h, 0Fh, 15h) [reset = 0000h]
7.6.5
DAC-X-IOUT-MISC-CONFIG Register (address = 04h, 0Ah, 10h, 16h) [reset = 0000h]
7.6.6
DAC-X-CMP-MODE-CONFIG Register (address = 05h, 0Bh, 11h, 17h) [reset = 0000h]
7.6.7
DAC-X-FUNC-CONFIG Register (address = 06h, 0Ch, 12h, 18h) [reset = 0000h]
7.6.8
DAC-X-DATA Register (address = 19h, 1Ah, 1Bh, 1Ch) [reset = 0000h]
7.6.9
COMMON-CONFIG Register (address = 1Fh) [reset = 0FFFh]
7.6.10
COMMON-TRIGGER Register (address = 20h) [reset = 0000h]
7.6.11
COMMON-DAC-TRIG Register (address = 21h) [reset = 0000h]
7.6.12
GENERAL-STATUS Register (address = 22h) [reset = 00h, DEVICE-ID, VERSION-ID]
7.6.13
CMP-STATUS Register (address = 23h) [reset = 0000h]
7.6.14
GPIO-CONFIG Register (address = 24h) [reset = 0000h]
7.6.15
DEVICE-MODE-CONFIG Register (address = 25h) [reset = 0000h]
7.6.16
INTERFACE-CONFIG Register (address = 26h) [reset = 0000h]
7.6.17
SRAM-CONFIG Register (address = 2Bh) [reset = 0000h]
7.6.18
SRAM-DATA Register (address = 2Ch) [reset = 0000h]
7.6.19
DAC-X-DATA-8BIT Register (address = 40h, 41h, 42h, 43h) [reset = 0000h]
7.6.20
BRDCAST-DATA Register (address = 50h) [reset = 0000h]
7.6.21
PMBUS-PAGE Register [reset = 0300h]
7.6.22
PMBUS-OP-CMD-X Register [reset = 0000h]
7.6.23
PMBUS-CML Register [reset = 0000h]
7.6.24
PMBUS-VERSION Register [reset = 2200h]
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curves
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Documentation Support
9.1.1
Related Documentation
9.2
Receiving Notification of Documentation Updates
9.3
Support Resources
9.4
Trademarks
9.5
Electrostatic Discharge Caution
9.6
Glossary
10
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RTE|16
MPQF149D
Thermal pad, mechanical data (Package|Pins)
RTE|16
QFND525B
Orderable Information
slasf60_oa
slasf60_pm
1
Features
• AEC-Q100 qualified for automotive applications:
Temperature grade 1: –40°C to +125°C, T
A
Programmable voltage or current outputs with flexible configuration:
Voltage outputs:
1 LSB DNL
Gains of 1 ×, 1.5 ×, 2 ×, 3 ×, and 4 ×
Current outputs:
1 LSB INL and DNL (8-bit)
±25-μA, ±50-μA, ±125-μA, ±250-μA output-range options
Programmable comparator mode for all channels
High-impedance output when VDD is off
High-impedance and resistive pulldown power-down modes
50-MHz SPI-compatible interface
Automatically detects I
2
C, SPI, or
PMBus™
interface
1.62-V V
IH
with V
DD
= 5.5 V
General-purpose input/output (GPIO) configurable as multiple functions
Predefined waveform generation: sine wave, triangular, sawtooth
User-programmable nonvolatile memory (NVM)
Internal, external, or power-supply as reference
Wide operating range:
Power supply: 1.8 V to 5.5 V
Temperature range: –40˚C to +125˚C
Tiny package: 16-pin WQFN (3 mm × 3 mm)
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