SNLS663 December   2021 DP83TC814R-Q1 , DP83TC814S-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Timing Diagrams
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Diagnostic Tool Kit
        1. 8.3.1.1 Signal Quality Indicator
        2. 8.3.1.2 Electrostatic Discharge Sensing
        3. 8.3.1.3 Time Domain Reflectometry
        4. 8.3.1.4 Voltage Sensing
        5. 8.3.1.5 BIST and Loopback Modes
          1. 8.3.1.5.1 Data Generator and Checker
          2. 8.3.1.5.2 xMII Loopback
          3. 8.3.1.5.3 PCS Loopback
          4. 8.3.1.5.4 Digital Loopback
          5. 8.3.1.5.5 Analog Loopback
          6. 8.3.1.5.6 Reverse Loopback
      2. 8.3.2 Compliance Test Modes
        1. 8.3.2.1 Test Mode 1
        2. 8.3.2.2 Test Mode 2
        3. 8.3.2.3 Test Mode 4
        4. 8.3.2.4 Test Mode 5
    4. 8.4 Device Functional Modes
      1. 8.4.1  Power Down
      2. 8.4.2  Reset
      3. 8.4.3  Standby
      4. 8.4.4  Normal
      5. 8.4.5  Media Dependent Interface
        1. 8.4.5.1 100BASE-T1 Master and 100BASE-T1 Slave Configuration
        2. 8.4.5.2 Auto-Polarity Detection and Correction
        3. 8.4.5.3 Jabber Detection
        4. 8.4.5.4 Interleave Detection
      6. 8.4.6  MAC Interfaces
        1. 8.4.6.1 Media Independent Interface
        2. 8.4.6.2 Reduced Media Independent Interface
        3. 8.4.6.3 Reduced Gigabit Media Independent Interface
      7. 8.4.7  Serial Management Interface
      8. 8.4.8  Direct Register Access
      9. 8.4.9  Extended Register Space Access
      10. 8.4.10 Write Address Operation
        1. 8.4.10.1 MMD1 - Write Address Operation
      11. 8.4.11 Read Address Operation
        1. 8.4.11.1 MMD1 - Read Address Operation
      12. 8.4.12 Write Operation (No Post Increment)
        1. 8.4.12.1 MMD1 - Write Operation (No Post Increment)
      13. 8.4.13 Read Operation (No Post Increment)
        1. 8.4.13.1 MMD1 - Read Operation (No Post Increment)
      14. 8.4.14 Write Operation (Post Increment)
        1. 8.4.14.1 MMD1 - Write Operation (Post Increment)
      15. 8.4.15 Read Operation (Post Increment)
        1. 8.4.15.1 MMD1 - Read Operation (Post Increment)
    5. 8.5 Programming
      1. 8.5.1 Strap Configuration
      2. 8.5.2 LED Configuration
      3. 8.5.3 PHY Address Configuration
    6. 8.6 Register Maps
      1. 8.6.1 Register Access Summary
      2. 8.6.2 DP83TC814 Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Physical Medium Attachment
          1. 9.2.1.1.1 Common-Mode Choke Recommendations
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Signal Traces
      2. 11.1.2 Return Path
      3. 11.1.3 Metal Pour
      4. 11.1.4 PCB Layer Stacking
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Open Alliance and IEEE 802.3bw 100BASE-T1 compliant
    • Passes Level IV emissions with Integrated LPF
  • SAE J2962-3 EMC compliant
  • Configurable I/O voltages: 3.3 V, 2.5 V, and 1.8 V
  • MAC interfaces: MII, RMII, RGMII and SGMII
  • Optional separate voltage rail for MAC interface pins (3.3 V, 2.5 V, 1.8 V)
  • AEC-Q100 qualified for automotive applications:
    • Temperature grade 1: –40°C to +125 °C ambient operating temperature
    • ±8-kV HBM ESD for pins 12 and 13
    • IEC61000-4-2 ESD classification level 4 for pins 12 and 13: ±8-kV contact discharge
  • IEEE 1588 SFD support
  • TSN compliant with 802.3br frame pre-emption support
  • Low active power operation: < 230 mW
  • Diagnostic tool kit
    • Signal quality indication (SQI)
    • Time domain reflectometry (TDR)
    • Electrostatic discharge sensor
    • Voltage sensor
    • PRBS Built-in Self-Test
    • Loopbacks
  • VQFN, wettable flank packaging
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