SLPS427D October 2012 – September 2015 CSD17313Q2Q1
PRODUCTION DATA.
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This 30-V, 24-mΩ, 2-mm x 2-mm SON NexFET™ power MOSFET is designed to minimize losses in power conversion applications and is optimized for 5-V gate drive applications. The 2-mm × 2-mm SON offers excellent thermal performance for the size of the package.
Added text for spacing
TA = 25°C | TYPICAL VALUE | UNIT | ||
VDS | Drain-to-Source Voltage | 30 | V | |
Qg | Gate Charge Total (4.5 V) | 2.1 | nC | |
Qgd | Gate Charge Gate-to-Drain | 0.4 | nC | |
RDS(on) | Drain-to-Source On Resistance | VGS = 3 V | 31 | mΩ |
VGS = 4.5 V | 26 | mΩ | ||
VGS = 8 V | 24 | mΩ | ||
VGS(th) | Threshold Voltage | 1.3 | V |
PART NUMBER | QTY | MEDIA | PACKAGE | SHIP |
---|---|---|---|---|
CSD17313Q2Q1 | 3000 | 13-Inch Reel | SON 2-mm × 2-mm Plastic Package | Tape and Reel |
CSD17313Q2Q1T | 250 | 7-Inch Reel |
TA = 25°C | VALUE | UNIT | |
---|---|---|---|
VDS | Drain-to-Source Voltage | 30 | V |
VGS | Gate-to-Source Voltage | +10 / –8 | V |
ID | Continuous Drain Current (package limited) | 5 | A |
Continuous Drain Current (silicon limited), TC = 25°C | 19 | ||
Continuous Drain Current(1) | 7.3 | ||
IDM | Pulsed Drain Current, TA = 25°C(2) | 57 | A |
PD | Power Dissipation(1) | 2.4 | W |
Power Dissipation, TC = 25°C | 17 | ||
TJ, TSTG | Operating Junction and Storage Temperature Range |
–55 to 150 | °C |
EAS | Avalanche Energy, Single Pulse, ID = 19A, L = 0.1mH, RG = 25Ω |
18 | mJ |
On State Resistance vs Gate to Source Voltage |
Gate Charge |