SLLS790D June   2007  – June 2021 TRS3232E

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 ESD Ratings - IEC Specifications
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics — Device
    7. 6.7 Electrical Characteristics — Driver
    8. 6.8 Electrical Characteristics — Receiver
    9. 6.9 Switching Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power
      2. 8.3.2 RS232 Driver
      3. 8.3.3 RS232 Receiver
    4. 8.4 Device Functional Modes
      1. 8.4.1 VCC Powered by 3 V to 5.5 V
      2. 8.4.2 VCC Unpowered, VCC = 0 V
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

1 Features

  • ESD protection for RS-232 bus pins
    • ±15 kV (HBM)
    • ±8 kV (IEC61000-4-2, Contact discharge)
    • ±15 kV (IEC61000-4-2, Air-gap discharge)
  • Meets or exceeds the requirements of TIA/EIA-232-F and ITU V.28 standards
  • Operates with 3-V to 5.5-V VCC supply
    • Interoperable with RS-232 down to 2.7-V VCC
  • Operates up to 250 kbps
  • Two drivers and two receivers
  • Low supply current: 300 μA (typical)
  • External capacitors: 4 × 0.1 μF
  • Accepts 5-V logic input with 3.3-V supply
  • Available in near chip-scale package (QFN-16, 3 mm x 3 mm), 85% smaller than SOIC-16
  • Pin compatible to alternative high-speed devices (1 Mbps)
    • SN65C3232E (–40°C to +85°C)
    • SN75C3232E (0°C to 70°C)
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