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Shrink Module Size with Flip Chip on Lead (FCOL) Package Technology
SSZT739
April 2018
TPS82130
,
TPSM84209
,
TPSM846C24
CONTENTS
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Shrink Module Size with Flip Chip on Lead (FCOL) Package Technology
1
2
3
Example of Various Package Types Offered by Texas Instruments
A More Detailed Look at the inside and outside of the TPSM84209 Power Module
Smaller Package Size.
Overmolded Package.
Improved Thermals.
Good Emi.
Excellent Reliability.
IMPORTANT NOTICE
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Full reading width
Comfortable reading width
Expanded reading width
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